Trough body of hole enlarging trough for cutting silicon slice by diamond line

Abstract

The invention discloses a trough body of a hole enlarging trough for cutting a silicon slice by a diamond line. The trough body comprises an inner trough body, an outer trough body, a liquid guiding device, a liquid intake device and a cooling device, wherein the inner trough body and the outer trough body are arranged to be nested internally and externally, the liquid guiding device is connectedwith the outer trough body and extends to the upper end of the inner trough body, the liquid intake device is fixed to the inner trough body, and the cooling device is arranged at the lower end of theouter trough body. The liquid guiding device comprises a liquid guiding pipe and a valve arranged on the liquid guiding pipe. The liquid intake device is fixed to the upper end of the inner wall of one side, close to a connection hose, of the inner trough body, and comprises a liquid depositing box and a plurality of spiral flow deflectors arranged at the lower end of the liquid depositing box. The cooling device comprises a refrigerator and a cooling water pipe connected with the refrigerator. The trough body of the hole enlarging trough is provided with the inner trough body and the outer trough body which are nested and matched internally and externally, the inner trough body can absorb a large amount of heat after reacting with the silicon slice, therefore reduction of the temperatureof drug liquid is achieved through circulation of liquid in the inner trough body and the outer trough body, the overall structural design is reasonable, and the space occupation rate is low.

Description

technical field [0001] The invention relates to a tank body for preparing silicon wafers, in particular to a tank body of a reaming tank for diamond wire cutting silicon wafers. Background technique [0002] As an environmentally friendly and renewable energy technology, photovoltaic power generation technology has developed rapidly in recent years, but how to further improve the conversion efficiency of batteries and reduce battery production costs has become the main problem facing the development of the industry. With the maturity of diamond wire cutting technology, diamond wire cut silicon wafers can be introduced to the market. The cost of diamond wire cut silicon wafers is much lower than that of traditional mortar wire cut silicon wafers, but the traditional texturing process cannot be prepared on the surface of diamond wire cut silicon wafers. The suede surface with light-trapping effect, black silicon technology increases the absorption of light by preparing micro-n...

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Problems solved by technology

[0004] In order to overcome the deficiencies of the above-mentioned prior art, the present invention provides a reaming tank body for diamond wire cutting silicon wafers to solve the problems of large structure occupation space, poor cooling effect of the chemical solution and uneven dispersion of the chemical solution in the prior art. The problem

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