Temperature measurement circuit and temperature measurement structure

Abstract

The invention provides a temperature measurement circuit and a temperature measurement structure; the temperature measurement circuit comprises the following structures: a temperature measurement resistor formed by a snakelike line copper foil on a printed circuit board and used for connecting with a to-be-measured element; a measuring circuit used for measuring the voltage of the temperature measurement resistor when the to-be-measured element temperature changes, wherein the resistance of the temperature measurement resistor changes with the temperature; an analog to digital conversion circuit used for converting the measured and obtained voltage in an analog signal mode into a voltage in a digital signal mode; a processor used for obtaining the temperature corresponding to the current resistance value of the temperature measurement resistor according to a corresponding relation between the voltage and the temperature. The temperature measurement circuit is formed by the snakelike line copper foil on the printed circuit board, so the PCB line can replace a temperature sensor like a thermistor, thus measuring the temperature of a laser diode; only the printed circuit board is formed between the laser diode and a semiconductor refrigerator, no other sensor and unit are needed, so the assembling structure is simple.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a temperature measuring circuit and a temperature measuring structure. Background technique [0002] In the fiber laser, the laser diode (LD, Laser Diode) is the core component, and its output optical power and optical wavelength have a crucial impact on the performance of the laser. LD is a temperature-sensitive device, and a temperature change of 0.1°C has a significant impact on the wavelength of light. LD as a power device usually uses a semiconductor refrigerator (TEC, Thermoelectric Cooler) as a cooling device. In this way, LD, TEC and heat sink form a structure similar to a sandwich, and in order to test the temperature of LD, a temperature sensing device such as a thermistor NTC is usually placed between LD and TEC. Since NTC has a certain thickness, metal plates such as aluminum or copper plates with slots are usually required between the LD and TEC, and th...

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Problems solved by technology

[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a temperature measurement circuit and a temperature measurement structure, which are used to solve the complex assembly structure caused by using thermistors to test the temperature of laser diodes in the prior art. and low reliability issues

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