Superconducting quantum computing chip integrated package structure and method

A technology of superconducting quantum and computing chips, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc.

Active Publication Date: 2018-01-09
TSINGHUA UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the above-mentioned technical problems, the present invention provides an integrated packaging structure and method for a superconducting quantum computing chip to solve the problem of the interaction between multiple superconducting qubits on the superconducting quantum computing chip and the input and output circuits. role problem

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  • Superconducting quantum computing chip integrated package structure and method
  • Superconducting quantum computing chip integrated package structure and method
  • Superconducting quantum computing chip integrated package structure and method

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Embodiment Construction

[0036] In order to make the purpose, technical solution and advantages of the present invention more clear, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other.

[0037] In order to achieve large-scale quantum computing, it is required that the number of qubits integrated on the chip reaches a certain number. According to the estimation of published literature in the world, a quantum computer with more than 50 qubits integrated on the quantum chip can demonstrate a higher performance than the classical supercomputer. A computer with more powerful computing power. In addition, in order to correct the errors generated in the operation process, quantum error correction is required. Generally, several physical qubits are used to form a log...

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Abstract

The invention discloses a superconducting quantum computing chip integrated package structure and method. The integrated package structure comprises a superconducting quantum computing chip, and a flip chip packaged together with the superconducting quantum computing chip. An insulation substrate of the superconducting quantum computing chip has a plurality of mutually-coupled superconducting quantum bits and first communication lines connected with the superconducting quantum bits and used for carrying out control and readout on the superconducting quantum bits. The flip chip has a pluralityof superconductive resonant cavities. The superconductive resonant cavities are corresponding to the superconducting quantum bits and the first communication lines, and are used for carrying out magnetic shielding on each superconducting quantum bit and each first communication line. Magnetic shielding can be carried out on each superconducting quantum bit and each first communication line, so that crosstalk between input and output leads and influence on quantum bits are reduced, de-coherence time of the quantum bits is improved, and requirement for large-scale quantum computation is reached.

Description

technical field [0001] The invention relates to the field of superconducting quantum computing, in particular to an integrated packaging structure and method for a superconducting quantum computing chip. Background technique [0002] Quantum computers use the basic principle of quantum mechanics, the superposition of quantum states, to achieve information processing tasks that are difficult for classical computers to complete. In the current research, because it is compatible with the current very mature traditional silicon integrated circuit processing technology, the device parameters can also be well and accurately controlled during the design, processing and preparation process, and can be integrated, using superconducting qubits Superconducting quantum computing is one of the most promising solutions for building quantum computers. [0003] How to maintain the quantum nature of qubits, that is, maintain their coherence, and at the same time be able to regulate specific...

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Application Information

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IPC IPC(8): H01L23/31H01L21/768H01L23/552
Inventor 陈炜刘建设张颖珊赵昌昊
Owner TSINGHUA UNIV
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