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A kind of high thermal conductivity ceramic substrate and preparation method thereof

A high thermal conductivity ceramic and substrate technology, applied in the field of electronic packaging materials, can solve problems such as poor mechanical properties and thermal conductivity, and achieve the effects of enhanced bonding, improved thermal conductivity, and improved mechanical properties

Active Publication Date: 2020-12-08
广东威世新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem mainly solved by the present invention is to provide a high thermal conductivity ceramic substrate and its preparation method in view of the shortcomings of traditional ceramic substrates with poor mechanical properties and thermal conductivity

Method used

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  • A kind of high thermal conductivity ceramic substrate and preparation method thereof

Examples

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Comparison scheme
Effect test

example 1

[0031] Mix nano-silica and silane coupling agent in a beaker at a mass ratio of 10:11, and add anhydrous ethanol 12 times the mass of nano-silica to the beaker, move the beaker into a digital speed measuring constant temperature magnetic stirrer, and The temperature is 60°C and the rotation speed is 360r / min. After stirring and mixing, the treatment liquid is obtained. The glass fiber and the treatment liquid are mixed in the flask according to the mass ratio of 1:8, and the flask is moved into the ultrasonic oscillator, and the frequency is 55kHz. Under the condition of ultrasonic vibration for 22 minutes, filter to obtain a filter cake, move the filter cake into a drying oven, and dry it at a temperature of 90°C for 80 minutes to obtain a modified glass fiber; in parts by weight, 80 parts of oxidized Aluminum powder, 15 parts of iron oxide powder, 25 parts of copper oxide powder, 25 parts of carbon powder, 18 parts of boron oxide powder, 16 parts of modified glass fiber, 14 p...

example 2

[0033]Mix nano-silica and silane coupling agent in a beaker at a mass ratio of 10:11, and add anhydrous ethanol 12 times the mass of nano-silica to the beaker, move the beaker into a digital speed measuring constant temperature magnetic stirrer, and The temperature is 60°C and the rotation speed is 360r / min. After stirring and mixing, the treatment liquid is obtained. The glass fiber and the treatment liquid are mixed in the flask according to the mass ratio of 1:8, and the flask is moved into the ultrasonic oscillator, and the frequency is 55kHz. Under the condition of ultrasonic vibration for 22 minutes, filter to obtain a filter cake, move the filter cake into a drying oven, and dry it at a temperature of 90°C for 80 minutes to obtain a modified glass fiber; in parts by weight, 80 parts of oxidized Aluminum powder, 18 parts of boron oxide powder, 16 parts of modified glass fiber, 14 parts of metal oxide whiskers and 5 parts of cryolite; adding boron oxide powder, cryolite an...

example 3

[0035] In parts by weight, weigh 80 parts of alumina powder, 15 parts of iron oxide powder, 25 parts of copper oxide powder, 25 parts of carbon powder, 18 parts of boron oxide powder, 16 parts of glass fiber, and 14 parts of metal oxide whiskers and 5 parts of cryolite; carbon powder, boron oxide powder, cryolite and glass fiber are added to the mixer and stirred and mixed to obtain a mixture, which is added to a ball mill, and zirconia ball milling beads with 5 times the quality of the mixture are added After ball milling for 3 hours, pass through a 120-mesh sieve to obtain the mixture powder. Mix the mixture powder, alumina powder, iron oxide powder, copper oxide powder and metal oxide whiskers, add them to the mold, and move the mold into the press , press molding at a temperature of 80°C to obtain a billet, move the billet into a sintering furnace, and feed argon gas into the furnace at a rate of 120mL / min, under the protection of argon, at a temperature of 1300°C , sinter...

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Abstract

The invention discloses a high-thermal-conductivity ceramic base plate and a manufacturing method thereof, and belongs to the technical field of electronic encapsulating materials. The manufacturing method comprises the following steps: sequentially weighing 70-80 parts by weight of aluminum oxide powder, 10-15 parts by weight of iron oxide powder, 20-25 parts by weight of copper oxide powder, 20-25 parts by weight of carbon powder, 13-18 parts by weight of boron oxide powder, 12-16 parts by weight of modified glass fibers, 8-14 parts by weight of metal oxide crystal whiskers and 3-5 parts byweight of cryolite; mixing and ball-milling carbon powder, boron oxide powder, cryolite and modified glass fibers, and sieving to obtain mixed material powder; mixing mixed material powder, aluminum oxide powder, iron oxide powder, copper oxide powder and metal oxide crystal whiskers to obtain a mixture, adding the mixture into a mould, pressing and forming the mixture in the mould to obtain blank; and transferring the blank into a sintering furnace to sinter, thereby obtaining the high-thermal-conductivity ceramic base plate. The ceramic base plate manufactured by the manufacturing method hasexcellent heat conduction performance and mechanical strength.

Description

technical field [0001] The invention discloses a ceramic substrate with high thermal conductivity and a preparation method thereof, belonging to the technical field of electronic packaging materials. Background technique [0002] In the electronic packaging process, the substrate mainly plays the role of mechanical support protection and electrical interconnection (insulation). With the gradual development of electronic packaging technology towards miniaturization, high density, multi-function and high reliability, the power density of electronic systems increases accordingly, and the problem of heat dissipation becomes more and more serious. Poor heat dissipation will lead to device performance degradation, structural damage, delamination or burnout. Good device heat dissipation depends on optimized heat dissipation structure design, packaging material selection (thermal interface material and heat dissipation substrate), and packaging manufacturing process. Among them, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/10C04B35/81C04B35/82C04B35/622C04B35/626
Inventor 王若梅徐颜峰陈龙
Owner 广东威世新材料有限公司