Screen miss-coating glass passivation mold and technique

Abstract

The invention discloses a screen miss-coating glass passivation mold, which comprises a silicon monocrystal chip, a stainless steel wire mesh screen and a stainless steel scraper, wherein table etching troughs are arranged in the silicon monocrystal chip; the stainless steel wire mesh screen is provided with bosses and soak areas; the bosses are arranged at one side of the stainless steel wire mesh screen; arrangement, positions and boundary dimensions of the soak areas are consistent with those of the table etching troughs in single side of the silicon monocrystal chip; the soak areas are arranged at the adjacent positions at two sides of the corresponding bosses; a high blade of 2-5CM is arranged at one side of the stainless steel scraper; and the protruding heights of the bosses are 3-5microns smaller than the depths of the table etching troughs in the silicon monocrystal chip. A screen miss-coating glass passivation technique comprises the following steps of registering; glass paste coating and blade coating; glass paste molding and screen removing; and glass burning. Through arrangement of the bosses, excessive glass paste is prevented from being scraped to the middle invalidposition of a glass guide channel.

Description

technical field [0001] The invention relates to a passivation process method for screen leak-coated glass, which is applied in the fields of semiconductor chip manufacturing and wafer processing, and is especially applied in the manufacture and application of mesa technology devices. Background technique [0002] Glass passivation generally includes knife-scraping glass passivation and electrophoresis glass passivation. The knife-scraping glass passivation uses a scraper to scrape the glass paste into the glass tank on the surface of the silicon single wafer, and then sinters it through high-temperature glass. The operation method It is relatively simple, and the investment in equipment is small, but the surface of the silicon single wafer is prone to scratches of different procedures. The surface of the silicon single wafer needs to be wiped to remove invalid glass powder. There is a thick invalid glass powder at the bottom of the corrosion tank on the table, and the glass s...

AI Technical Summary

Problems solved by technology

[0002] Glass passivation generally includes knife-scraping glass passivation and electrophoresis glass passivation. The knife-scraping glass passivation uses a scraper to scrape the glass paste into the glass tank on the surface of the silicon single wafer, and then sinters it through high-temperature glass. The operation method It is relatively simple, and the investment in equipment is small, but the surface of the silicon single wafer is prone to scratches of different procedures. The surface of the silicon single wafer needs to be wiped to remove invalid glass powder. There is a thick invalid glass powder at the bottom of the corrosion tank on the table, and the glass stress is relatively large; Electrophoretic glass passivation, through the electrophoresis equipment to absorb a certain thickness of glass powder in the etching groove of the silicon single wafer table, and then sintering and forming through high-temperature glass, the upper edge of the silicon single wafer table etching groove close to the surface is well protected, but the silicon wafer There are protruding glass frits on the surface, which affects the production of the subsequent photolithography process, and the equipment is relatively expensive. There is a thicker invalid glass frit at the bottom of the corrosion tank on the table top, and the glass stress is greater.

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