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Wiring board assembly

A technology of wiring substrates and joints, applied in the direction of electric solid-state devices, semiconductor devices, stacked printed circuit boards, etc., can solve the problems of easy shrinkage of flexible substrate 110, damage of joint parts, disconnection, etc.

Active Publication Date: 2021-12-31
NGK INSULATORS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, there are cases where the left and right sides of the flexible substrate 110 tend to be curled (refer to Figure 9 Arrows), so that the junction between the contacts arranged on the left and right ends of the contact pattern 114 and the contact pattern 124 is damaged and the wire is broken.

Method used

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Embodiment Construction

[0025] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. figure 1 is a cross-sectional view showing a schematic configuration of the plasma processing apparatus 10, figure 2 It is a perspective view showing the internal structure of the plate heater 30 .

[0026] Such as figure 1 As shown, a plasma processing apparatus 10 as a semiconductor manufacturing apparatus includes a vacuum chamber 12 , a shower head 14 , and an electrostatic chuck heater 20 . The vacuum chamber 12 is a box-shaped container formed of aluminum alloy or the like. The shower head 14 is disposed on the top surface of the vacuum chamber 12 . The shower head 14 discharges the processing gas supplied from the gas introduction pipe 16 into the vacuum chamber 12 through a plurality of gas injection holes 18 . In addition, the shower head 14 functions as a cathode plate for generating plasma. The electrostatic chuck heater 20 is a device for suc...

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PUM

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Abstract

The present invention provides a wiring board assembly. The connecting FPC ( 75 ) and the plate heater ( 30 ) are bonded via solder bonding members. In the connection FPC (75), the ground contact (90b) is connected to a connection electrode (90d) extending along the row of contacts, and the connection electrode (90d) is provided so as to protrude outward from both ends of the row. In the plate heater (30), the ground pad (46b) is connected to the connection pad (46d) extending along the row of pads, and the connection pad (46d) is provided on the outer side than both ends of the row. stick out.

Description

technical field [0001] The present invention relates to a wiring board assembly. Background technique [0002] Conventionally, as a wiring substrate bonded body of a flexible substrate and a printed circuit board, a bonded body in which a contact portion such as a contact pattern on a flexible substrate is electrically connected to a corresponding contact portion on a printed circuit board by soldering is known (for example, Patent Document 1 ). An example of such a wiring board assembly is shown in Figure 9 . In the flexible substrate 110 , the cover film 112 is removed at the substrate end, so that the ends of the copper foil patterns arranged in parallel at a constant pitch are exposed as contact patterns 114 . Then, the contact pattern 114 is overlaid on the contact pattern 124 formed on the printed circuit board 120 , and the solder preliminarily attached to at least one surface of the contact pattern 114 and the contact pattern 124 is melted to perform electrical co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67109H01L21/6833H05K1/0209H05K1/0215H05K1/118H05K2201/09381H01L21/67103H05K1/0212H05K1/028H05K3/363H05K2201/041H01L21/185H01L21/324H01L24/26H01L21/67092H01L2021/60007H01L21/67069H01L21/6831H05K1/144
Inventor 竹林央史
Owner NGK INSULATORS LTD