Method for assembling components of printed circuit board

A printed circuit board and assembly method technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of long assembly cycle, easy installation of electricity in wrong positions, etc., and achieve the effect of improving assembly efficiency

Inactive Publication Date: 2018-01-19
SHAANXI QIANSHAN AVIONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The assembly cycle is long, surface mount resistors an

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Provided is an assembly method of printed circuit board components. The printed circuit board has installation positions for multiple components; the multiple components include two types: special processing components and general components;

[0019] Step 1. Prepare a coordinate map, and use a point on the printed circuit board as the coordinate origin to map and record the installation position of the special processing components on the printed circuit board on the coordinate map;

[0020] Step 2: Prepare the printed circuit board assembly drawing, classify the general components according to the device grade, and define a symbol, color or pattern for each device grade; The device is marked;

[0021] Step 3: according to the coordinate values ​​in step 1, process and install special processing components; according to the symbols, colors or patterns in step 2, install general components.

[0022] Wherein, the special treatment components are components whose solder ...

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PUM

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Abstract

The present invention relates to a method for assembling components of a printed circuit board. The method has the advantages that the assembly efficiency is improved, the time required for searchingfor the components is significantly reduced, the assembly period is short and at least a half of an assembly time is saved, phenomena of wrong assembly and missed assembly are reduced, and the reworkrate is reduced.

Description

technical field [0001] The invention belongs to the category of technological methods and is applied to military aviation products and civilian products. In particular, it involves component board assembly with a large number of surface mount components, small components and high assembly density. Background technique [0002] The production tasks of the production workshop are new products and mass production. At present, the company's newly developed products are developing in the direction of miniaturization, and 70% to 80% of the component boards of the new products are manually welded. There are many problems in the production process of the new products, immature assembly, low efficiency, and repair. The rate is higher. For example: an audio and video acquisition and encoding module has 81 components and a quantity of 634 items. Most of the devices used are surface-mount devices with fine pitches and high assembly density. There are 129 capacitors and 89 J-CT41G-040...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 董荷蕊尹青松
Owner SHAANXI QIANSHAN AVIONICS
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