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Super-field depth high-pixel infrared scanning imaging module

A technology of infrared scanning and camera modules, which is applied in the direction of optical components, optics, instruments, etc., can solve the problem of low pixel and achieve the effect of good resolution, overall length and simple structure

Active Publication Date: 2018-01-23
GUANGDONG HONGJING OPTOELECTRONICS TECHONLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to overcome the common problem of low pixels in existing infrared scanning camera modules, an embodiment of the present invention provides a super depth of field high pixel infrared scanning imaging camera module

Method used

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  • Super-field depth high-pixel infrared scanning imaging module
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  • Super-field depth high-pixel infrared scanning imaging module

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Embodiment Construction

[0018] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0019] Such as figure 1 As shown, the ultra-depth-of-field high-pixel infrared scanning imaging camera module includes at least a lens, a base that cooperates with the lens, and a light-sensing device disposed on the base for receiving optical signals from the lens. The lens is equipped with an optical system. The optical system is sequentially provided with: a first lens 1 , a second lens 2 , a third lens 3 , a fourth lens 4 , and a fifth lens 5 along the optical axis from the object plane to the image plane 7 .

[0020] The object plane side of the first lens 1 is a c...

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Abstract

The embodiment of the invention discloses a super-field depth high-pixel infrared scanning imaging module which comprises a first lens, a second lens, a third lens, a fourth lens and a fifth lens in sequence from an object plane to an image plane along an optical axis, wherein the first lens is a biconvex lens with positive focal power; the second lens is a biconcave lens with negative focal power; the objective surface of the third lens is a plane; the image plane of the third lens is a convex surface with positive focal power; the fourth lens is a biconcave lens with negative focal power; the object plane of the fifth lens is a concave surface; the image plane of the fifth lens is a convex surface with negative focal power; an optical system meets the equation that TTL / F is greater than0.8 and less than or equal to 1.2; TTL is the distance between a side top point of the object plane of the first lens of the optical system and an imaging surface; and f is the focal length of the whole optical system. According to the embodiment of the invention, the module mainly consists of five lenses and is simple in structure, and with the combination of different lenses, and due to reasonable optical focal power allocation, the module has good properties of low cost, short total lengths, super field depths, high pixel, large target surfaces, good analysis properties and the like.

Description

Technical field: [0001] The invention relates to a camera module, in particular to a super depth of field high pixel infrared scanning imaging camera module. Background technique: [0002] The infrared scanning camera modules currently used in the market generally have problems such as low pixels, small shooting range, and many application scenarios. Because the lens adopts an all-glass structure, there are still problems such as high cost in mass production and long system length. Invention content: [0003] In order to overcome the common problem of low pixels in existing infrared scanning camera modules, an embodiment of the present invention provides an infrared scanning imaging camera module with super depth of field and high pixels. [0004] The ultra-depth-of-field high-pixel infrared scanning imaging camera module is sequentially arranged along the optical axis from the object plane to the image plane: a first lens, a second lens, a third lens, a fourth lens, and ...

Claims

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Application Information

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IPC IPC(8): G02B13/00G02B13/14G02B13/18
Inventor 汪鸿飞刘振庭刘佳俊符致农尹小玲杜亮陈波徐程
Owner GUANGDONG HONGJING OPTOELECTRONICS TECHONLOGY CO LTD