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Packaging cover and manufacturing method thereof

A technology for encapsulating a cover plate and a manufacturing method, which is applied in the directions of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc., can solve problems such as poor thermal conductivity and affect the encapsulation effect, and achieves a stable encapsulation structure and improves the heat dissipation effect. , the effect of improving adhesion

Active Publication Date: 2018-01-23
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current packaging structure usually uses a packaging cover, but the packaging cover generally has defects that are easy to peel off from the packaging resin and have poor thermal conductivity, which affects the packaging effect.

Method used

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  • Packaging cover and manufacturing method thereof
  • Packaging cover and manufacturing method thereof
  • Packaging cover and manufacturing method thereof

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Embodiment Construction

[0033] In order for those skilled in the art to better understand the technical solution of the present invention, the encapsulation cover provided by the present invention and its manufacturing method will be described in detail below with reference to the accompanying drawings.

[0034] The packaging structure usually uses a packaging cover made of metal or non-metallic materials to effectively prevent the intrusion of water and oxygen. However, this package cover often has the following problems:

[0035] First, the metal package cover plate is less effective in resisting cold and heat shocks. Once the environment changes in temperature and temperature, the deformation of the metal will easily cause the metal cover plate to peel off from the encapsulant, affecting the encapsulation effect. And the metal cover is more susceptible to environmental damage.

[0036] Second, although the non-metallic package cover can avoid the phenomenon that the metal cover has poor thermal s...

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Abstract

The present invention provides a packaging cover and a manufacturing method of the packaging cover. The packaging cover comprises a cover body made of a flexible ceramic material. The first surface ofthe cover body is provided with a groove structure that is filled with an adhesive material and a thermally conductive material. The packaging cover provided by the invention enables bending propertywhile having the function of blocking water and oxygen, fails to change the shape due to the thermal expansion and contraction, and improves adhesion with a packaging adhesive and heat dissipation effect.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a packaging cover plate and a manufacturing method thereof. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) is a display lighting technology that has gradually developed in recent years, especially in the display industry. Due to its advantages of high response, high contrast, and flexibility, it is considered to have a wide range of applications. prospect. In recent years, the emergence of curved and flexible OLED displays has made people's eyes even brighter. However, since the OLED device will be corroded and damaged under the action of water vapor and oxygen, the current OLED device cannot be separated from the protection of the encapsulation structure. However, to achieve curved or flexible display, the OLED device must be bent, which will cause stress on its internal structure and further test the packaging effect o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H10K99/00
CPCY02E10/549Y02P70/50H10K2102/311H10K59/871H10K59/8794H10K50/841H10K50/87H10K71/00H10K77/111
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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