Temperature measurement board and temperature measurement system

A technology of temperature measuring lines and temperature measuring points, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of low temperature measurement efficiency of circuit boards, achieve high applicability, and improve the effect of temperature measurement efficiency

Active Publication Date: 2018-01-30
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a temperature measuring board and a temperature measuring system, which are used to solve the problem of low efficiency of circuit board temperature measurement in the prior art

Method used

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  • Temperature measurement board and temperature measurement system
  • Temperature measurement board and temperature measurement system
  • Temperature measurement board and temperature measurement system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] see figure 1 , is a structural schematic diagram of a temperature measuring plate provided by an embodiment of the present invention. like figure 1 As shown, the temperature measuring board includes a motherboard 1 .

[0034] Wherein, the motherboard 1 includes a plurality of mutually separated temperature measurement areas arranged along the direction of entering the furnace. In an exemplary embodiment, the shown motherboard 1 includes three temperature measurement areas, namely the first temperature measurement area 11, the second temperature measurement area 12 and the third temperature measurement area 13; the above three temperature measurement areas can be along the The direction of entering the furnace of the temperature measuring plate is set, and the direction of entering the furnace is as follows: figure 1 As shown, it can be understood as the direction in which the temperature measuring board enters the reflow oven; wherein, along the furnace entering dire...

Embodiment 2

[0041] see figure 2 , is a schematic structural diagram of another temperature measuring board provided by an embodiment of the present invention. like figure 2 As shown, the temperature measuring board includes a motherboard 1; in the embodiment of the present invention, the motherboard 1 is provided with three temperature measuring areas separated from each other along the direction of entering the furnace, that is, the first temperature measuring area 11, the second Temperature measurement area 12 and the third temperature measurement area 13; In each temperature measurement area, a plurality of different types of temperature measurement elements 2 are provided, and the temperature measurement elements 2 include BGA elements 21, FQN elements 22, temperature sensitive There are 4 types of components 23 and connector components. The difference between the embodiment of the present invention and the first embodiment lies in that the temperature measuring elements 2 of the ...

Embodiment 3

[0046] see image 3 , is a schematic structural diagram of another temperature measuring board provided by an embodiment of the present invention. like image 3 As shown, the temperature measuring board includes a motherboard 1; in the embodiment of the present invention, the motherboard 1 is provided with three temperature measuring areas separated from each other along the direction of entering the furnace, that is, the first temperature measuring area 11, the second Temperature measurement area 12 and the third temperature measurement area 13; In each temperature measurement area, a plurality of different types of temperature measurement elements 2 are provided, and the temperature measurement elements 2 include BGA elements 21, FQN elements 22, temperature sensitive There are four types of elements 23 and connector elements 24 in total. The difference between the embodiment of the present invention and the first embodiment lies in that, in each temperature measurement ar...

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Abstract

The embodiment of the invention provides a temperature measurement board and a temperature measurement system. The temperature measurement board includes a motherboard; wherein the motherboard includes a plurality of separated temperature measurement regions disposed along a direction towards a furnace; a plurality of different types of temperature measurement elements are arranged in each temperature measurement region; each temperature measurement element is provided with a plurality of temperature measurement points; the plurality of temperature measurement points are used for connecting temperature measurement lines so that the temperature measurement elements can be connected to a temperature analyzer via the temperature measurement lines. The temperature measurement board is dividedinto different measurement regions where multiple types of temperature measurement elements are configured. Thus, the temperature measurement board can cover the element types of different boards andhas good applicability. When the temperature of a reflow furnace is tested by using the temperature measurement board, it is not necessary to prepare corresponding temperature measurement boards for different test boards, thereby improving temperature measurement efficiency.

Description

technical field [0001] The invention relates to the technical field of circuit board production equipment, in particular to a temperature measuring board and a temperature measuring system. Background technique [0002] The circuit board is the hardware carrier of electronic equipment such as servers. The process of packaging electronic devices on the circuit board through various packaging processes is called PCBA (English: Printed Circuit Board Assembly, Chinese: Printed Circuit Board Assembly). In the PCBA process, the circuit board usually needs to undergo a reflow process in a reflow oven, so that the pins of the electronic device are packaged on the circuit board by soldering. [0003] In order to ensure the soldering quality of the reflow soldering process, it is necessary to accurately measure the temperature in the reflow soldering furnace before implementing the reflow soldering process to ensure accurate temperature control. At present, a temperature measuring bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 信召建
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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