Vertical type light emitting diode
A light-emitting diode, vertical technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of vertical light-emitting diode current distribution, the reliability of light-emitting distribution needs to be improved, etc., and achieve the effect of uniform light-emitting distribution
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no. 1 example
[0027] combine Figure 1 to Figure 2 As shown, this embodiment provides a vertical light emitting diode, which includes a stacked layer D, a first trench 43, a first insulating layer 5, a conductive plug 8, a bonding metal layer 6, a conductive substrate 7, and an N electrode 70 . The second trench 44 and the P electrode 9 . exist figure 1 In , since the conductive plug 8 and the P electrode 9 are blocked, they are indicated by dotted lines. in:
[0028] The stacked layer D includes an N-type semiconductor layer 1 , a quantum well layer 2 , a P-type semiconductor layer 3 and a conductive layer 4 which are sequentially stacked along the thickness direction X. The conductive layer 4 is electrically connected to the P-type semiconductor layer 3 .
[0029] There are several first grooves 43 distributed at intervals. The first trench 43 is located in the stacked layer D. The first trench 43 penetrates the conductive layer 4 , the P-type semiconductor layer 3 , and the quantum w...
no. 2 example
[0055] One of the differences between the second embodiment and the first embodiment is that in the second embodiment, as image 3 As shown, the ohmic contact layer 40 and the metal reflective layer 41 are provided with an opening 46 at a position corresponding to the second groove 44 in the thickness direction X, and a part of the metal protection layer 42 is filled in the opening 46, and is electrically connected to the P electrode 9. . In other words, the P electrode 9 is electrically connected to the ohmic contact layer 40 and the metal reflective layer 41 through the metal protective layer 42 .
[0056] Furthermore, in this embodiment, the diameter of the opening 46 is larger than the opening width of the second trench 44 at the place corresponding to the P-type semiconductor layer 3, so that the portion of the upper surface of the P-type semiconductor layer 3 close to the second trench 44 Not covered by the ohmic contact layer 40 and the metal reflective layer 41, preve...
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