Touch sensitive layer and manufacturing method thereof

A fabrication method and technology of a sensing layer, which are applied to instruments, electrical digital data processing, and input/output processes of data processing, etc., can solve the problems of prone to breakage or bubbles, high cost, poor perspective, etc., to avoid folding. Effect of damage or bubble phenomenon, saving equipment cost and reducing production cost

Pending Publication Date: 2018-02-09
SHENZHEN JUNDA OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a touch sensing layer, a touch module and its Production Method

Method used

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  • Touch sensitive layer and manufacturing method thereof
  • Touch sensitive layer and manufacturing method thereof
  • Touch sensitive layer and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] like figure 1 and figure 2 As shown, the touch sensing layer 1 provided by an embodiment of the present invention includes a flexible transparent conductive layer 102 and a flexible protective film attached to the flexible transparent conductive layer 102. The flexible transparent conductive layer 102 includes a plurality of sensing lines, a plurality of driving A circuit and bridge structure, a plurality of the sensing circuits extend along a first direction and are parallel to each other, a plurality of the driving circuits extend along a second direction and are parallel to each other, the first direction and the second direction are perpendicular to each other, so The induction circuit includes a plurality of cascaded induction electrode blocks (R X ITO) 1021, the drive circuit includes a plurality of cascaded drive electrode blocks (T X ITO) 1022, the bridge structure includes an insulating layer 1023 and a bridge 1024 formed by printing transparent photosensit...

Embodiment 2

[0089] like image 3 As shown, an embodiment of the present invention also provides a method for fabricating a touch sensing layer, including the following steps:

[0090] S101, the transparent conductive film base material is pasted on the glass substrate through UV type OCA glue.

[0091] Specifically, a transparent conductive film substrate with a thickness of 23 μm was attached to the glass substrate with UV-type OCA glue.

[0092] Among them, UV-type OCA glue, as a combination of LOCA and OCA, has the advantages of two kinds of bonding materials, and thus improves their respective shortcomings. Specifically, the UV-type OCA adhesive has the advantages of LOCA that can be completely filled, and completely solves the problems of bubbles and late rebound caused by OCA lamination. The UV-type OCA glue also has the advantage of solid-state lamination of OCA, which eliminates the problem of LOCA glue overflow and eliminates the glue-wiping process. More importantly, UV-type ...

Embodiment 3

[0109] like Figure 4 As shown, the third aspect of the embodiment of the present invention provides a touch module, which includes a polarizer 3, a flexible circuit board (not shown), and the touch sensing layer 1 provided in the first embodiment. The touch sensing layer 1. The edge of the side formed with the flexible transparent conductive layer is printed with silver paste 2, and the side of the touch sensing layer 1 formed with the silver paste 2 and the polarizer 3 are bonded by the first optical glue 4, and the flexible transparent conductive layer is passed through. The silver paste 2 is electrically connected to the flexible circuit board. It can be understood that by attaching the polarizer 3, the silver paste 2 and the touch sensing layer 1, and electrically connecting the touch sensing layer 1 and the flexible circuit board, the composition has the touch sensor in the first embodiment. A touch module with all the beneficial effects of the sensing layer 1.

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PUM

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Abstract

The invention belongs to the field of touch screens, and relates to a touch sensing layer and a manufacturing method thereof. The touch sensing layer includes a flexible transparent conductive layer and a flexible protective film bonded on the flexible transparent conductive layer, the flexible transparent conductive layer includes a plurality of sensing lines, a plurality of driving lines and a bridge structure, and the sensing lines include A plurality of cascaded sensing electrode blocks, the driving circuit includes a plurality of cascaded driving electrode blocks, and the bridge structure is used to electrically connect adjacent sensing electrode blocks and/or to connect adjacent The drive electrode block, the bridge structure includes an insulating layer and a bridge formed by printing transparent photosensitive silver glue on the insulating layer. The touch sensing layer uses transparent photosensitive silver glue as a bridge, which greatly reduces the production cost. In addition, the touch-sensing layer is processed on a glass substrate, which overcomes the processing difficulties of ultra-thin materials in the yellow light process.

Description

technical field [0001] The invention belongs to the technical field of touch screens, and in particular relates to a touch sensing layer and a manufacturing method thereof. Background technique [0002] With the wide application of flexible electronics, Roll-to-Roll production technology has also begun to receive attention. By definition, flexible electronics is a technology in which components and materials are built on flexible or bendable substrates of thin plastic or metal sheets. The so-called Roll-to-Roll is a high-efficiency and continuous production method, which is specially used for processing flexible films. The flexible board is added with functions for specific purposes or processed on the surface of the film or flexible board, and then the processed film or flexible board is rolled into a cylinder or cut. For the surface processing of film or flexible board, it mainly includes several main process technologies such as direct pattern writing, precision embossi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
CPCG06F3/041G06F2203/04103
Inventor 唐代雨
Owner SHENZHEN JUNDA OPTOELECTRONICS
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