A convenient heat dissipation target installation device

Abstract

The invention discloses a target material installation device facilitating heat dissipation. The target material installation device comprises a base. A water tank is fixedly mounted on the lower sidewall of an inner cavity of the base. A water pump is fixedly mounted on the upper sidewall of the water tank. The upper and lower sidewalls of the water pump are both fixedly provided with water suction pipes. The right sidewall of one vertical plate is fixedly provided with a fixed block. A locking block is fixedly mounted on the front sidewall of a sliding block. A fixed plate is fixedly arranged on the upper sidewall of the locking block. The middle portion of the front sidewall of the fixed block is provided with a through hole. A metal plate is fixedly mounted on the front side of the inner sidewall of the through hole. A cylindrical block is fixedly arranged on the rear sidewall of the metal plate. A cooling pipe is wound around the outer sidewall of the cylindrical block. Through the structure of a slideway, the sliding block, the locking block and the fixed plate, the target material installation device facilitating heat dissipation can fix and lock a target material, is convenient to replace and can dissipate heat generated in the working process through the metal plate, the cylindrical block, the cooling pipe and a heat dissipation plate.

Description

technical field [0001] The invention relates to the technical field of target installation, in particular to a target installation device for convenient heat dissipation. Background technique [0002] In the manufacture of large-scale integrated circuits, a metal film is generally formed on a silicon wafer by physical vapor deposition sputtering target method. During the sputtering process, the target is usually welded with the backplane by solder to form a sputtering target assembly. The back plate plays the role of supporting and conducting heat during the assembly of the target assembly and the sputtering process, but welding the target on the back plate will be very troublesome when replacing the target, and the heat is only transmitted through the back plate. The heat dissipation efficiency is very low. If we can design a target installation device that can easily replace the target without welding and has a good heat dissipation effect, this kind of problem can be solv...

AI Technical Summary

Problems solved by technology

[0002] In the manufacture of large-scale integrated circuits, a metal film is generally formed on a silicon wafer by physical vapor deposition sputtering target method. During the sputtering process, the target is usually welded with the backplane by solder to form a sputtering target assembly. The back plate plays the role of supporting and conducting heat during the assembly of the target assembly and the sputtering process, but welding the target on the back plate will be very troublesome when replacing the target, and the heat is only transmitted through the back plate. The heat dissipation efficiency is very low. If we can design a target installation device that can easily replace the target without welding and has a good heat dissipation effect, this kind of problem can be solved. For this reason, we propose a target installation that is convenient for heat dissipation. device

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