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Manufacturing method of LED light source of novel structure

A technology of LED light source and manufacturing method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of LED open circuit, gold wire breakage, etc., achieve the effects of improving reflectivity and gloss, flexible selection, and various molding and processing techniques

Pending Publication Date: 2018-02-16
SHENZHEN SMALITE OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The most serious silver layer has reacted, and the gold wire is broken, causing the LED to open

Method used

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  • Manufacturing method of LED light source of novel structure
  • Manufacturing method of LED light source of novel structure
  • Manufacturing method of LED light source of novel structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] Such as Figure 1-5 As shown, this specific embodiment adopts the following technical scheme: it includes a base material 1, a bracket filling glue material a, an LED bracket 2, a fluorescent glue 3, a chip 4, a gold wire 5 and an air-avoiding device 6, and the top of the base material 1 passes through The base material filling glue a is fixedly connected with the LED bracket 2, and the upper middle part of the LED bracket 2 is provided with an air-avoiding device 6, and a chip 4 is installed above the air-avoiding device 6, and a gold wire 5 is welded on the chip 4, and the chip 4 Fluorescent glue 3 is packaged above the gold wire 5 .

[0016] As a preference, the bottom of the LED bracket 2 is an inverted T-shaped design.

[0017] As preferably, the base material 1 is coated with a metal silver layer b on the lower surface by vacuum sputtering technology,

[0018] The upper surface is sequentially coated with metallic silver layer c, aluminum oxide or titanium oxide...

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PUM

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Abstract

The invention discloses a manufacturing method of an LED light source of a novel structure, and relates to the technical field of LED light sources. The upper part of a base material is fixedly connected with an LED support through a base material filled rubber material; an avoiding device is arranged at the middle part of the upper part of the LED support; a chip is mounted above the avoiding device; the chip is welded with a gold thread; and fluorescence rubber is packaged inside the chip and the upper part of the gold thread. The main body of the base material with flexible section can be selected according to the performance requirements of products, and can be metals such as copper, aluminum and iron. Through the treatment of a vacuum sputtering technology or some special technologies, metals and metal oxides are deposited on the surfaces, the base material is protected from being vulcanized, brominated, oxidized and the like, and the reflectivity and glossiness of the base material are improved. Titanium oxide on the surface and the thicknesses of titanium oxide and silver layers are controlled, and routing and positive and negative tin soldering functions on the substrate surface of the special LED support can be realized. The forming processing technology of the special LED support is varied.

Description

technical field [0001] The invention relates to a method for manufacturing an LED light source with a novel structure, and belongs to the technical field of LED light sources. Background technique [0002] Since the advent of LED, it has been widely valued and developed rapidly, which is inseparable from its own advantages. These advantages are summarized as follows: high brightness, low operating voltage, low power consumption, miniaturization, long life, impact resistance and stable performance. The development prospect of LED is very broad, and it is currently developing towards higher brightness, higher weather resistance, higher luminous density, and higher luminous uniformity. However, in the actual process of producing and using LED products, we often encounter problems such as "product vulcanization (including vulcanization, halogenation, oxidation and other pollution phenomena) leading to product failure". These problems have brought certain losses to customers and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/62
CPCH01L33/005H01L33/48H01L33/62
Inventor 李俊东柳欢陈健平刘云
Owner SHENZHEN SMALITE OPTOELECTRONICS CO LTD