Ruggedized computer suitable for multiple sizes and specifications of modules

A reinforced computer and multi-size technology, which is applied in the field of airborne electronic equipment structure and technology, can solve the problems of determining module size, affecting product weight and volume, and wasting board area.

Inactive Publication Date: 2018-02-27
XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It cannot determine the module size according to the function and circuit requirements required by each module. When the required circuits and devices of the module are too many, it has to split the module function to adapt to the board area of ​​other modules; when the required circuits and devices of the module are too large When it is small, it will waste the board area and indirectly affect the weight and volume of the entire product

Method used

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  • Ruggedized computer suitable for multiple sizes and specifications of modules
  • Ruggedized computer suitable for multiple sizes and specifications of modules
  • Ruggedized computer suitable for multiple sizes and specifications of modules

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Embodiment Construction

[0016] Below in conjunction with accompanying drawing, the present invention is further described:

[0017] Such as Figures 1 to 4 As shown, a reinforced computer adaptable to multi-size and specification modules, including a box body (1), a front panel (2), an upper cover (3), a lower cover (4), a fastening device (5), a motherboard Assemblies (6), type I modules (7), the motherboard assembly (6) are installed in the box body (1), the type I module (7) is installed on the motherboard assembly (6), and pass through the box body (1) The guide rail (101) is fastened; the front panel (2) is installed on the front surface of the box (1); the upper cover (3) is installed on the upper surface of the box (1), and the lower cover (4) is installed on the box The lower surface of the body (1); the fastening device (5) is installed on the two sides of the computer; not only the type I module (7) is installed on the motherboard assembly (6) and the box body (1), but also is installed by...

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Abstract

The invention belongs to the technical field of airborne electronic device structure processes and relates to a ruggedized computer suitable for multiple sizes and specifications of modules. Multiplesizes and specifications of modules exist in the same device, more optimized computer appearance and weight are given, meanwhile the standard size and interface and environment conditions of an airborne electronic device can be met, and a good solution is provided for the airborne electronic device to adapt to multiple sizes and specifications of modules. In the structural form, the more optimizedcomputer structure size or a similar standard-sized computer is combined according to the area and number of printing boards needed by the functional modules while structural supporting, electrical connection, heat-dissipating protection and other functions can be provided for the modules of the airborne electronic device, and accordingly the space of the modules and the whole computer are more reasonably utilized.

Description

technical field [0001] The invention belongs to the technical field of structure technology of airborne electronic equipment, and relates to a reinforced computer adaptable to modules of multiple sizes and specifications. Background technique [0002] The structural form of electronic equipment generally has a decisive impact on the weight and volume of the product. With the continuous improvement of the requirements for miniaturization, light weight, and reliability of airborne electronic equipment, it was originally composed of a set of functional modules with standard width and height. Advanced computer equipment is no longer the best choice for products. It cannot determine the module size according to the function and circuit requirements required by each module. When the required circuits and devices of the module are too many, it has to split the module function to adapt to the board area of ​​other modules; when the required circuits and devices of the module are too...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18
CPCG06F1/181G06F1/183
Inventor 冯波李晓明姜红明
Owner XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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