Pad pasting manufacturing method of porous thin plate

Abstract

The invention discloses a pad pasting manufacturing method of a porous thin plate. The method comprises steps that two production plates are laminated together; the production plates are plates afterboring, copper deposition and complete plate electroplating processing which are sequentially carried out; dry pad pasting of top surfaces and bottom surfaces of the two laminated production plates iscarried out; reverse lamination of the two laminated production plates is carried out, so the top surfaces pasted with dry pads respectively contact with the bottom surfaces pasted with dry pads; drypad pasting of the top surfaces and the bottom surfaces of the two laminated production plates in the reverse lamination mode is carried out, and dry pad pasting of upper surfaces and lower surfacesof the two production plates is realized. The method is advantaged in that the process flow is changed, thickness of the plates is enhanced, a dry pad contraction phenomenon caused by thermal expansion and contraction of the air in holes is avoided, and a dry pad lamination problem existing in the upper and lower surfaces is avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for producing a film for a porous thin plate. Background technique [0002] In the process of making circuit graphics, printed circuit boards need to use dry film to attach to the copper surface for photosensitive treatment. The current dry film is mainly completed by manual film laminating machines and automatic film laminating machines; Both sides of the film are pressed and attached to the board at the same time to achieve the purpose of making graphics on both sides. [0003] In the process of making the outer circuit on the circuit board, because there are through holes drilled on the circuit board in the early stage, when the film is applied on both sides at the same time, the air in the through hole is heated and expanded by the hot pressure roller, and the volume becomes larger. After the board is cooled, the volume of the air in the thr...

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem that the dry film on the hole after the dry film is pasted in the process of making the outer circuit of the existing circuit board shrinks and overlaps together to affect the sealing effect, and the dry film breaks, and provides a method for making a film for a porous thin plate. , this method increases the thickness of the board by changing the process flow, thereby avoiding the shrinkage of the dry film caused by the thermal expansion and contraction of the air in the hole, and avoiding the superposition of the upper and lower dry films