heat sink

Abstract

The invention relates to a heat-dissipating device and aims to dissipate heat from a heat source. The heat-dissipating device comprises an accommodating tank, a heat-insulating unit and a pipe body, wherein the accommodating tank comprises an outlet end, an inlet end and an accommodating space, and is used for receiving the heat from the heat source from above; the heat-insulating unit is arrangedin the accommodating space of the accommodating tank and comprises a heat-insulating nozzle; the heat-insulating nozzle comprises a first opening, a second opening and a necking part; the first opening communicates with the inlet end; the second opening communicates with the accommodating space; the necking part is adjacent to the second opening; and the pipe body is connected with the outlet endand the inlet end, and then a closed circulation loop is formed by the pipe body and the accommodating tank. By adoption of the heat-dissipating device provided by the invention, a working fluid canbe effectively protected against vaporization caused by the heat generated from the heat source before entering the accommodating tank, and the enough working fluid in the accommodating tank can be ensured. Consequently, the heat-dissipating device can have the relatively high heat-dissipating efficiency, and is applicable to a high-wattage electronic product.

Description

Technical field [0001] The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device arranged in a portable electronic device. Background technique [0002] Generally, the single cycle of the heat sink is to place the heat source under the containing tank. After the liquid working fluid flows into the containing tank, it is heated by the heat source to boil into a gaseous state and flow out of the containing tank. The gaseous working fluid flows to the condenser. The cooling and condensing become liquid and return to the holding tank to complete a single cycle. However, if the temperature generated by the heat source is too high, the liquid working fluid will boil into a gaseous state before returning to the accommodating tank, which will cause the single cycle to fail and the heat sink will not be able to effectively dissipate heat. In addition, the working fluid flows in the closed circuit formed by the containing tank and the c...

AI Technical Summary

Problems solved by technology

However, if the temperature generated by the heat source is too high, the liquid working fluid boils into a gaseous state before returning to the accommodating tank, so that the single cycle fails, and the cooling device cannot effectively dissipate heat.

In addition, the working fluid flows in the closed circuit formed by the storage tank and the conduit only through its own phase change, the flow effect is poor and there may not be enough working fluid in the storage tank to react, so the cooling device The cooling effect of the limited

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