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Heat-curable resin composition for semiconductor encapsulation

A resin composition and semiconductor technology, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problems of wafer itself cracking, resin blockage, resin cracks, etc., and achieve the effect of excellent moisture resistance

Inactive Publication Date: 2018-03-13
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such a composition, warpage of the wafer occurs due to the thermal history of the 3D packaging process, and problems of damage to the semiconductor element and cracking of the wafer itself occur due to the warpage
On the other hand, in conventional low-elastic resin materials represented by silicone compounds, since the resin is soft, there are problems of resin clogging during grinding and resin cracking in reliability tests (for example, Patent Document 3 )

Method used

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  • Heat-curable resin composition for semiconductor encapsulation
  • Heat-curable resin composition for semiconductor encapsulation
  • Heat-curable resin composition for semiconductor encapsulation

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0111] [Method for preparing thermosetting resin composition]

[0112] The thermosetting resin composition of the present invention can be produced, for example, by the method shown below. First, (A) and (B) are obtained by mixing, stirring and / or dispersing (A) cyanate compound and (B) phenolic curing agent simultaneously or separately, while performing heat treatment as required. ) ingredient mixture. (A) to (C) components and ( E) Mixture of ingredients. Then, the mixture of (A) to (E) components is obtained by mixing the (D) inorganic filler in the mixture of (A) to (C) components and (E) components, stirring and / or dispersing them . According to its use, at least one of the additives of mold release agent, flame retardant and ion trapping agent can also be added and mixed in the mixture of (A) and (B), (A)~(C) In the mixture of components and (E) components, or in the mixture of (A)-(E) components.

[0113] The equipment for mixing, stirring and dispersing is not pa...

Embodiment

[0120] Hereinafter, although the Example of this invention is shown, this invention is not limited to the following Example. In addition, the viscosity in this specification means the viscosity at 23 degreeC measured using the B type rotational viscometer in accordance with the method of JISK7117-1:1999.

[0121] [Manufacturing method of sheet-like thermosetting resin composition]

[0122] Various components shown below contained in the thermosetting resin composition were mixed at the ratio shown in Table 1, and kneaded by a two-roll mill to obtain a thermosetting resin composition. The unit of the numerical values ​​shown in the compounding ratio in Table 1 is "parts by mass".

[0123] Examples 1 to 5 were produced by applying the obtained mixture of thermosetting resin compositions to the surface of a polyester film (protective layer) subjected to hot rolling and release treatment so as to have a thickness of 100 μm. and the sheet-shaped cured products of Comparative Exam...

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Abstract

Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer. The heat-curable resin composition for semiconductor encapsulation comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule, and containing a particular cyanate ester compound that has a viscosity of not higher than 50 Pa*s; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; (D) an inorganic filler surface-treated with a silane coupling agent; and (E) an ester compound.

Description

technical field [0001] The present invention relates to a thermosetting resin composition for semiconductor encapsulation and a method for producing a resin-encapsulated semiconductor device using a cured product of the composition. Background technique [0002] In recent years, mobile information communication terminals such as smartphones and tablets have been equipped with thin, compact, multifunctional semiconductor devices capable of high-speed processing so that they can process large-capacity information at high speed. Such a semiconductor device uses TSV (through silicon via (through silicon via)) technology to connect semiconductor elements in multiple layers, and after performing flip-chip connection on an 8-inch or 12-inch silicon substrate, it is encapsulated in each by thermosetting resin. On a silicon substrate on which a plurality of semiconductor elements connected in multiple layers are mounted, excess solid resin on the semiconductor elements is removed by ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08K9/06C08K7/18C08K5/17H01L23/29
CPCC08K5/17C08K7/18C08K9/06H01L23/295C08K2201/003C08L2201/08C08L2203/206C08L79/04C08G73/0655H01L23/293H01L2224/32225H01L2224/32245H01L2924/3511C08L61/06C08K5/103C08G18/8067C08K3/013C08K5/544H01L33/56C08G18/79C08K2201/005C08K5/5465C08K5/175C08G14/12C08K3/36H01L21/565H01L23/296C08L61/12
Inventor 隅田和昌中村朋阳串原直行
Owner SHIN ETSU CHEM IND CO LTD