LED package

Abstract

The invention discloses LED package. The LED package comprises a substrate, an LED chip, a fluorescent layer and a transparent layer, wherein the LED chip is arranged on the substrate, the fluorescentlayer wraps the LED chip, the transparent layer wraps the fluorescent layer, the LED chip, the fluorescent layer and the transparent layer all are connected with the substrate, the transparent layercomprises a transparent top layer and a transparent side wall, the transparent top layer is encircled by the transparent side wall, and the transparent side wall is gradually and downwards contractedfrom a transparent top surface and is of an inclination structure with large upper end and small lower end. The LED package provided by the invention is high in integral brightness.

Description

technical field [0001] The present invention relates to the technical field of LEDs, in particular to an LED packaging structure. Background technique [0002] Due to the characteristics of good energy saving and long service life of LED, its application is more and more extensive. The LED in the prior art includes a substrate, an LED chip arranged on the substrate, a fluorescent layer wrapping the LED chip, and a transparent layer wrapping the fluorescent layer. , where the LED chip is the light source, and the light is emitted from the surface of the LED chip except the bottom surface, and the light emitted from the side wall of the LED chip passes through the fluorescent layer and the transparent layer and is refracted sequentially. The shape of the fluorescent layer and the transparent layer is generally approximately arched or rectangular. The LED chip is generally placed in the middle of the transparent layer. This arrangement can reduce the reflection of light on the ...

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Problems solved by technology

[0002] Due to the characteristics of good energy saving and long service life of LED, its application is more and more extensive. The LED in the prior art includes a substrate, an LED chip arranged on the substrate, a fluorescent layer wrapping the LED chip, and a transparent layer wrapping the fluorescent layer. , where the LED chip is the light source, and the light is emitted from the surface of the LED chip except the bottom surface, and the light emitted from the side wall of the LED chip passes through the fluorescent layer and the transparent layer and is refracted sequentially. The shape of the fluorescent layer and the transparent layer is generally approximately arched or rectangular. The LED chip is generally placed in the middle of the transparent layer. This arrangement can reduce the reflection of light on the contact surface between layers, but the direction of the light changes after two refractions, especially the light emitted by the side wall of the LED chip. Due to the existing The transparent layer of the technology is generally epoxy resin, with a refractive index of 1.5 and air with a refractive index of 1. The calculated total reflection angle is 41.8°. After the transparent layer is refracted, the light direction is deflected downward by 0-48.2°, resulting in a considerable part of the light pointing to Although the substrate can further reflect light by setting a reflective layer on the substrate, part of the light energy is converted into heat energy during the reflection process, which reduces the overall brightness of the LED package

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