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A kind of flexible substrate and its preparation method, display

A flexible substrate and display technology, which is applied in the manufacture of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., can solve the problems of decreased water and oxygen resistance of flexible substrates, easy detachment of organic layers and inorganic layers, etc., and achieves enhanced water resistance. Oxygen capacity, improve quality, eliminate the effect of shedding

Active Publication Date: 2020-03-10
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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AI Technical Summary

Problems solved by technology

[0004] The present invention mainly provides a flexible substrate, its preparation method, and a display, and aims to solve the problem that the organic layer and the inorganic layer are easy to fall off when the flexible substrate is bent, which leads to the decrease of the water and oxygen blocking ability of the flexible substrate.

Method used

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  • A kind of flexible substrate and its preparation method, display
  • A kind of flexible substrate and its preparation method, display
  • A kind of flexible substrate and its preparation method, display

Examples

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no. 1 example

[0015] common reference figure 1 and figure 2 , the first embodiment of the preparation method of the flexible substrate provided by the present invention includes:

[0016] S11: forming a first organic layer 102 on the base substrate 101;

[0017] Specifically, polyimide can be coated on the base substrate 101 by a slit coating device to form a polyimide film, and then the polyimide film can be cured at high temperature to form the first organic layer 102 .

[0018] Optionally, the base substrate 101 is a glass substrate.

[0019] S12: forming a first buffer layer 103 on the first organic layer 102;

[0020] Specifically, silicide can be deposited on the first organic layer 102 by chemical vapor deposition to form the first buffer layer 103 .

[0021] Optionally, the silicide is one or more of a-Si, SiN, and SiO. When the silicide is one of a-Si, SiN, and SiO, the first buffer layer 103 is a single-layer structure , when the silicide is a variety of a-Si, SiN, and SiO,...

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Abstract

The present invention discloses a flexible substrate and a manufacturing method thereof, and a display device. The method comprises: forming a first organic layer over a base substrate; forming a first buffer layer over the first organic layer; forming an inorganic layer over the first buffer layer; and forming a second organic layer over the inorganic layer. In the method of the present invention, arrangement of the first buffer layer enhances adherence between the first organic layer and the inorganic layer, thereby reducing or even eliminating risk of separation of the first organic layer and the inorganic layer in a process of bending a flexible substrate, enhancing water and oxygen resistance of the flexible substrate, and increasing quality of the substrate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible substrate, a preparation method thereof, and a display. Background technique [0002] Flexible displays have become an inevitable trend in the future development of displays due to their advantages such as fashion, thinness, bendability, foldability, easy portability, high contrast, high reflectivity, and wide viewing angles. In the flexible display, the quality of the flexible display is guaranteed by preventing water and oxygen from entering the flexible display through the upper packaging structure and the bottom flexible substrate. The flexible substrate includes a single-layer PI (polyimide) structure flexible substrate and a multilayer The flexible substrate with multi-layer PI structure, because the water and oxygen blocking ability of the flexible substrate with multi-layer PI structure is much greater than the flexible substrate with single-layer PI structure...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1218H01L27/1262
Inventor 王选芸
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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