Hollow flexible circuit board and manufacturing method
A flexible circuit board and production method technology, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve problems such as pressure creases and poor lines, reduce pressure creases, increase reliability, and not easy to delaminate Effect
Active Publication Date: 2020-07-24
AVARY HLDG (SHENZHEN) CO LTD +1
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- Application Information
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Problems solved by technology
However, the traditional hollow board production process is prone to poor wiring and creases
Method used
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[0020] In order to further illustrate the technical means and effects that the present invention takes to reach the intended purpose of the invention, the following in conjunction with the appended Figure 1-9 And the preferred implementation mode, the specific implementation, structure, features and effects of the hollow flexible circuit board and its manufacturing method provided by the present invention are described in detail as follows.
[0021] see figure 1 , the first embodiment of the present invention provides a hollow flexible circuit board 100, the hollow flexible circuit board 100 includes a conductive circuit layer 16, a photosensitive resin layer 13 formed on a surface of the conductive circuit layer 16 and a formed The cover film layer 17 on the surface of the conductive circuit layer 16 away from the photosensitive resin layer 13 .
[0022] The conductive circuit layer 16 includes at least one conductive circuit 161 , at least one first pad 162 and at least on...
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The invention relates to a manufacturing method of a hollowed-out flexible circuit board, which comprises the steps of providing a double-sided copper-clad substrate, wherein the double-sided copper-clad substrate comprises a base layer and two copper foil layers respectively formed at two opposite surfaces of the base layer; forming a photosensitive resin layer at the surfaces of the two copper foil layers, wherein the photosensitive resin layer comprises a first surface and a second surface opposite to the first surface, the first surface faces towards the copper foil layer, and the photosensitive resin layer is further provided with at least one first opening; forming a copper plating layer at the second surface and in the first opening of each photosensitive resin layer; enabling the two copper plating layer to be manufactured into a conductive circuit layer, wherein the conductive circuit layer comprises a first welding pad; removing the base layer, and forming two flexible circuit substrates, wherein each flexible circuit substrate comprises the conductive circuit layer, the photosensitive resin layer and the copper foil layer; and removing the copper foil layers, and enabling the first surface to be flush with the end surface, which is away from the conductive circuit layer, of the first welding pad. The invention further relates to a hollowed-out flexible circuit board.
Description
technical field [0001] The invention relates to the field of circuit board production, in particular to a hollowed out flexible circuit board and a production method. Background technique [0002] As mid-to-high-end consumer electronics products (Smart Phone, Tablet, UltraBook, etc.) have increasingly stringent requirements for quality, thinness, and compactness, the design of circuit boards is becoming thinner and the circuits are more refined. Ordinary single-sided FPC has only one side that can be attached to components and assembled. In order to improve the convenience of mounting components and assembly without increasing the wiring density of the product, the design and application of hollow board (embossed board) was born; hollowed out board (embossed board) ) is a single-sided FPC with two-sided PAD, which can be attached to components or assembled at the same time. However, the traditional hollow board production process is prone to poor wiring and creases. Conte...
Claims
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IPC IPC(8): H05K1/11H05K3/40
CPCH05K1/111H05K3/40H05K2201/09036
Inventor 李卫祥
Owner AVARY HLDG (SHENZHEN) CO LTD