Glue dispensing device with ultrasonic vibration and glue dispensing method performed by using same
A technology of dispensing device and ultrasonic vibration, which is applied to devices and coatings that apply liquid to the surface, can solve problems such as the outstanding heat dissipation problem of adhesive LED chips, improve the bonding and fixing effect, and avoid poor bonding. Robust, thermal resistance reduction effect
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[0016] The present invention relates to a glue dispensing device with ultrasonic vibration and a glue dispensing method using the same. The glue dispensing device includes an ultrasonic transducer 1 and a glue head 2 fixed at the ultrasonic output end of the glue head 2, the working end of the glue head 2 is a diameter Gradually shrinking multi-level cylindrical steps, cylinders with different diameters are used to form glue drops 33 of different sizes. The glue dispensing device is used in the process of fixing the LED chip on the support. The specific operation process of the glue dispensing method is through the specific embodiments. To explain.
[0017] Specific embodiments, such as figure 1 As shown, the working end of the dispensing head 2 is a two-stage cylinder with different diameters. After being dipped, the glue adheres evenly around it to form a glue drop 3 with a regular shape. The working ends of the glue drop 3 and the dispensing head 2 have A certain adhesive for...
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