Glue dispensing device with ultrasonic vibration and glue dispensing method performed by using same

Abstract

The invention relates to a glue dispensing device with ultrasonic vibration and a glue dispensing method performed by using the same. The glue dispensing device comprises an ultrasonic transducer, anda glue dispensing head fixed at an ultrasonic output end; a working end of the glue dispensing head is a multistage cylindrical step with a gradually reduced diameter; the glue dispensing device is used for a process of fixing LED wafers on a bracket; the bracket is provided with glue dispensing areas; firstly, the working end of the glue dispensing head moves above a container with glue; the depth of the glue is adjusted according to needed glue drops; the working end of the glue dispensing head extends into the glue, and is contacted with the bottom of the container; after the glue dispensing head is lifted out from the surface of the glue, the tail end thereof is wrapped with the glue drops; then, the working end of the glue dispensing head moves above the glue dispensing areas; the ultrasonic transducer is started; the glue drops are deviated from the glue dispensing head to fall on the surfaces of the glue dispensing areas; then, the ultrasonic transducer is turned off; the stepsare circularly repeated in sequence to finish glue dispensing of all glue dispensing areas; and the surface tension of the glue drops is destroyed by ultrasonic vibration, so that the bonding force between the LED wafers and the bracket and the heat conducting efficiency can be improved.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and in particular relates to a glue dispensing device with ultrasonic vibration and a glue dispensing method using the glue dispensing device. Background technique [0002] The crystal bonding step in the LED packaging process is to apply conductive or non-conductive glue on the bottom of the bracket. Whether the chip is conductive or not depends on whether the chip is a top-down PN junction or a left-right PN junction, and then put the chip into the bracket for bonding. Fixed, in the prior art, the dispensing process is only through the dispensing head to dip glue, move to the dispensing position, and the glue is separated from the dispensing head to complete the dispensing process. There are many shortcomings in the existing dispensing methods, such as the bonding force between the LED chip and the bracket and the heat dissipation of the LED chip are relatively prominent. Therefore, it is...

AI Technical Summary

Problems solved by technology

[0002] The crystal bonding step in the LED packaging process is to apply conductive or non-conductive glue on the bottom of the bracket. Whether the chip is conductive or not depends on whether the chip is a top-down PN junction or a left-right PN junction, and then put the chip into the bracket for bonding. Fixed, in the prior art, the dispensing process is only through the dispensing head to dip glue, move to the dispensing position, and the glue is separated from the dispensing head to complete the dispensing process. There are many shortcomings in the existing dispensing methods, such as the bonding force between the LED chip and the bracket and the heat dissipation of the LED chip are relatively prominent. Therefore, it is necessary to improve the dispensing method in the LED packaging process. make improvements

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