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Display panel, manufacturing method therefor, and display device

A technology for display panels and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as uneven film formation and complex film packaging processes, and achieve window effect avoidance, production cost reduction, and effect of complexity

Active Publication Date: 2018-03-27
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device, so as to solve the problems of complicated and uneven film formation in the existing thin film packaging process

Method used

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  • Display panel, manufacturing method therefor, and display device
  • Display panel, manufacturing method therefor, and display device
  • Display panel, manufacturing method therefor, and display device

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Embodiment Construction

[0032] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described through implementation with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are the embodiment of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] refer to figure 1 As shown in , it is a schematic diagram of a display panel provided by an embodiment of the present invention. The display panel provided in this embodiment includes: a display substrate 10, the display substrate 10 includes at least one display area 11; an encapsulation structure 20 encapsulating the display area 11, the encaps...

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Abstract

The embodiment of the invention discloses a display panel, a manufacturing method therefor, and a display device. The display panel comprises a display substrate which comprises at least one display region; and a packaging structure for packaging the display region, wherein the packaging structure comprises at least one inorganic layer and at least one organic layer, and is formed by the first depositing of all film layers and the second etching. According to the embodiment of the invention, the packaging structure is formed by the first depositing of all film layers and the second photoetching, and there is no need of a mask for the deposition of the inorganic layer of the packaging structure, and there is also no need of a mask alignment system for the alignment of the mask, thereby reducing the packaging complexity and manufacturing cost. The thickness of the film layers of the packaging layers is uniform, and the surfaces of the film layers are flat, thereby solving a problem thatdifferent regions have different thickness values because of the depositing of the mask, and avoiding the window effect of mask deposition.

Description

technical field [0001] Embodiments of the present invention relate to display technologies, and in particular to a display panel, a manufacturing method thereof, and a display device. Background technique [0002] With the development of display technology, the application of flexible display technology is becoming more and more extensive. The existing flexible organic light emitting display panel structure generally includes a flexible substrate, a display device layer, and a thin film encapsulation layer. The thin film encapsulation layer generally includes an inorganic layer and an organic layer, the inorganic layer is used to block water and oxygen, and the organic layer is used to improve the flexibility of the thin film encapsulation layer. [0003] In a flexible organic light-emitting display panel, the inorganic layer of the thin film encapsulation layer is usually deposited after alignment using a mask mask. Specifically, before forming the thin film encapsulation...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8445H10K71/00
Inventor 冷传利李针英
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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