Adhesive tape, heat-dissipating sheet, electronic apparatus, and method of manufacturing adhesive tape

A technology of electronic equipment and adhesive tape, which is applied in the construction parts of electrical equipment, chemical instruments and methods, cooling/ventilation/heating transformation, etc., which can solve the problems of reduced heat dissipation, inability to maintain adhesive force, and poor appearance. Achieve excellent adhesion

Active Publication Date: 2018-03-27
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when further thinning of the above-mentioned adhesive tape is required, when the above-mentioned thin adhesive tape is bonded to an adherend, air bubbles are likely to remain at their interface, and as a result, the adhesive tape sometimes becomes Defective appearance caused by swelling, etc.
[0006] In addition, since the above-mentioned remaining air bubbles serve as thermal resistance, when the above-mentioned thin adhesive tape is used for bonding a heat-dissipating member and a heat-generating member, etc., a decrease in heat dissipation may be caused.
[0007] In addition, in order to achieve the above-mentioned thinning, the thinning of the adhesive layer has also been studied, and the adhesive layer that is thin and only has the above-mentioned release path for the air bubbles may not be able to maintain a practically sufficient adhesive force.

Method used

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  • Adhesive tape, heat-dissipating sheet, electronic apparatus, and method of manufacturing adhesive tape
  • Adhesive tape, heat-dissipating sheet, electronic apparatus, and method of manufacturing adhesive tape
  • Adhesive tape, heat-dissipating sheet, electronic apparatus, and method of manufacturing adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0178] "PET25×1J0L" (manufactured by Nippa Co., Ltd., a release liner with a silicone-based release-treated surface on the surface of a PET film with a smooth surface) was coated with the above-mentioned adhesive a using a roll coater, and then dried at 100°C. It was dried for 1 minute to prepare an adhesive layer with a thickness of 1 μm.

[0179] Next, the above-mentioned pressure-sensitive adhesive layer was transferred to one surface of "K100-2.0W" (manufactured by Mitsubishi Plastics Corporation, polyester film, thickness 2 μm) as a support to obtain a single-sided adhesive tape.

[0180] Next, using a gravure coater, the above-mentioned adhesive a was dot-printed on the other side of the above-mentioned support constituting the above-mentioned single-sided adhesive tape, and dried at 100° C. for 1 minute to obtain a figure 1 The shown adhesive tape is an adhesive tape having a total thickness of 6 μm of the substantially diamond-shaped 3 μm-thick adhesive portion. It sh...

Embodiment 2～12

[0183] The adhesive tape was produced by the method similar to Example 1 except having changed the shape, area, and the thickness of the adhesion part (B) into Tables 1-3.

Embodiment 13

[0185] Using a gravure coater, the above-mentioned adhesive a was dot-printed on "PET25×1J0L" (manufactured by Nippa Co., Ltd., a release liner having a silicone-based release-treated surface on the surface of a PET film with a smooth surface) at 100 °C and let it dry for 1 minute, thus forming figure 1 An adhesive portion having a thickness of 3 μm is shown in a substantially rhombic shape (the angle of the corner portion toward the moving direction of the adhesive tape is 60°). It should be noted that, among the above-mentioned adhesive parts, the distance between any adhesive part and the adjacent adhesive part is 0.1 mm.

[0186] Next, the above-mentioned adhesive part was transferred to one side of "K100-2.0W" (Mitsubishi Plastics Co., Ltd. product, polyester film, thickness 2 micrometers) as a support body, and the single-sided adhesive tape was obtained.

[0187] Next, using a gravure coater, the above-mentioned adhesive a is dot-printed on the other side of the suppor...

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Abstract

The present invention relates to an adhesive tape having two or more adhesive parts (B) on at least one surface (a) side of a supporting body (A), the adhesive tape being characterized in that a region which does not have an adhesive part (B) is present between the two or more adhesive parts (B), and the region communicates with ends of the adhesive tape. The present invention is useful in that air bubbles can be quickly removed from an interface between the adhesive tape and an adherend to thereby prevent the air bubbles from remaining on the interface, and a thin adhesive tape having excellent adhesion can be provided.

Description

technical field [0001] The present invention relates to a thin adhesive tape that can be used in, for example, manufacturing sites of electronic devices. Background technique [0002] Adhesive tapes are widely used in manufacturing sites of electronic equipment such as OA equipment and home appliances because of their excellent workability and high adhesion reliability. [0003] For the above-mentioned electronic devices, high functionality, miniaturization and thinning are required in recent years, especially for portable electronic terminals such as personal computers, digital cameras, electronic notebooks, mobile phones, PHS, smart phones, game devices, and electronic books. Further miniaturization and thinning are required. Along with this, thickness reduction is also required for the adhesive tape etc. which comprise the said portable electronic terminal. [0004] As the aforementioned thin adhesive tape, a double-sided adhesive tape having an adhesive layer having a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/20B32B27/00H01L23/36H05K7/20
CPCB32B27/00H01L23/36H05K7/20C09J7/20H05K7/20481C09J2301/204C09J2301/312
Inventor 山上晃今井克明
Owner DIC CORP
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