Method for manufacturing ceramic circuit board
A technology of ceramic circuit boards and manufacturing methods, which can be applied in the directions of circuit substrate materials, removal of conductive materials by chemical/electrolytic methods, and printed circuit parts, etc., and can solve problems such as difficulty in obtaining adhesion.
Inactive Publication Date: 2018-03-27
韩国株式会社科迈特
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Problems solved by technology
However, there is a problem that it is difficult to obtain sufficient adhesive force only by including copper oxide and bonding glass in the copper paste
Method used
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[0025] Hereinafter, preferred embodiments of the substrate manufacturing method of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms different from each other, and the present embodiment is only intended to complete the disclosure of the present invention and to fully inform those skilled in the art of the scope of the invention. supply.
[0026] figure 1 It is a flowchart of one Example of the manufacturing method of the ceramic circuit board of this invention. refer to figure 1 , an embodiment of the manufacturing method of the ceramic circuit board of the present invention begins with the step ( S1 ) of forming a titanium (Ti) thin film layer 20 on the ceramic substrate 10 .
[0027] The ceramic substrate 10 is not particularly limited, but is preferably a nitride. For example, it can be AlN or Si 3 N 4 ...
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The present invention relates to a method for manufacturing a ceramic circuit board and, more specifically, to a method for manufacturing a ceramic circuit board in which a circuit pattern is formed through printing. The method for manufacturing a ceramic circuit board according to the present invention comprises the steps of: a) forming a titanium (Ti) thin film layer on a ceramic board; b) forming a copper (Cu) thin film layer on the titanium (Ti) thin film layer; c) forming a copper (Cu) pattern layer on the copper (Cu) thin film layer by performing, at least once, a step of printing a copper (Cu) pattern on the copper (Cu) thin film layer, by using a copper paste, and then drying the copper (Cu) pattern; d) sintering the copper (Cu) pattern layer; e) removing the copper (Cu) thin filmlayer of a portion in which the copper (Cu) pattern layer is not formed; and f) removing the titanium (Ti) thin film layer of the portion in which the copper (Cu) pattern layer is not formed. The method for manufacturing a ceramic circuit board, according to the present invention, can easily manufacture a ceramic circuit board having an excellent coupling force between a metal pattern and the ceramic board.
Description
technical field [0001] The present invention relates to a method of manufacturing a ceramic circuit board, and more specifically, to a method of manufacturing a ceramic circuit board that forms a circuit pattern by printing. Background technique [0002] Since power supply elements for power supply and other elements that require high current and high voltage generate a very large amount of heat, as a substrate on which they are mounted, AlN, Si 3 N 4 A substrate made of a ceramic material such as Al or Cu is bonded to a metal plate such as Al or Cu. [0003] Such a substrate is manufactured by a method of forming a metal pattern by photolithography, etching, etc., after manufacturing an original plate by pasting a metal plate on a ceramic substrate. [0004] As a method of manufacturing an original plate, Korean Registered Patent No. 0477866 discloses a method of manufacturing a metal-ceramic composite substrate in which a ceramic substrate and a metal plate are bonded by...
Claims
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Login to View More IPC IPC(8): H05K3/38H05K3/06H05K3/10H05K1/03
CPCH05K1/03H05K3/06H05K3/10H05K3/38
Inventor 金珉秀金相周金炳吉
Owner 韩国株式会社科迈特