Vibrating diaphragm and MEMS microphone
A thin film and air hole technology, which is applied in the field of electronic equipment, can solve the problems of poor resistance to high-pressure shock and drop resistance, the inability to receive sound signals, and distortion of sound signals from MEMS microphones, so as to improve the ability to resist high-pressure shock and Anti-drop ability, improved low-frequency response characteristics, and improved sensitivity
Pending Publication Date: 2018-03-30
MG MICROELECTRONICS CO LTD
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Problems solved by technology
[0003] However, the existing MEMS microphones have poor low-frequency response characteristics, high-pressure shock resistance, and poor drop resistance. Once the electronic device containing the MEMS microphone is accidentally dropped to the ground, the diaphragm in the MEMS microphone will easily be damaged or damaged. If the MEMS microphone breaks, the sound signal received by the MEMS microphone will be distorted, affecting the conversion accuracy of the sound signal and the electrical signal, or the sound signal will no longer be received at all, seriously affecting the normal use of electronic equipment and user experience
Method used
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[0024] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0025] Such as figure 1 and figure 2 As shown, the diaphragm includes a film body 1 and a connecting portion 2. The film body 1 is planar, and the connecting portion 2 extends outward from the edge of the film body 1. The film body 1 can take the plane where the connecting portion 2 is located as a balanced position. Perform reciprocating vibration, the edge of the film body 1 is provided with a first arc-shaped hole group and a second arc-shaped hole group, an annular band-shaped area is formed between the first arc-shaped hole group and the second arc-shaped hole, and the first arc-shaped The hole group is composed of a plurality of first air holes 3, each of the first air holes 3 is provided with a first arc-shaped baffle 5, and the second arc-shaped hole group is composed of a plurality of sec...
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The invention discloses a vibrating diaphragm and an MEMS microphone, and belongs to the technical field of electronic equipment. The vibrating diaphragm provided by the invention comprises a diaphragm body and a connection part; multiple first air holes and second holes are arranged on the diaphragm body; the interior of each first air hole is provided with a first arc-shaped block sheet; and theinterior of each second air hole is provided with a second arc-shaped block sheet. The vibrating diaphragm is provided with the first air holes and the second air holes on the diaphragm body; the hardness of the vibrating diaphragm can be effectively reduced; the sensitivity of the vibrating diaphragm is improved; influence of thermal stress on the vibrating diaphragm in a production process canbe reduced; the high pressure impact resistance capability and the anti-falling capability of the vibrating diaphragm are improved; and, because the interior of each first air hole is provided with the first arc-shaped block sheet and the interior of each second air hole is provided with the second arc-shaped block sheet, the low-frequency response characteristic of the vibrating diaphragm can beeffectively improved. The invention further provides the MEMS microphone comprising the vibrating diaphragm.
Description
technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a vibrating membrane and a MEMS microphone using the vibrating membrane. Background technique [0002] A MEMS (digital) microphone is a microphone manufactured based on MEMS manufacturing technology, MEMS is an acronym for Micro Electro Mechanical System. MEMS microphones are often used in various mobile devices to pick up voice signals and convert voice signals into electrical signals for transmission. MEMS microphones generally consist of MEMS microcapacitance sensors, MEMS microcapacitor heads, micro-integrated conversion circuits, acoustic chambers and Composed of FR anti-interference circuit, the MEMS microcapacitor head includes a diaphragm, the diaphragm can directly receive the audio signal, and transmit it to the micro-integrated conversion circuit through the MEMS micro-capacitance sensor, the micro-integrated conversion circuit converts and amplifies the h...
Claims
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IPC IPC(8): H04R19/04H04R7/12
CPCH04R7/127H04R19/04H04R2201/003
Inventor 缪建民陈欣悦
Owner MG MICROELECTRONICS CO LTD