Pulsed laser single particle testing device and testing method for bare chip

Abstract

The invention relates to a pulsed laser single particle testing device and a testing method for a bare chip, which belong to the technical field of semiconductor device anti-space single particle effect ability detection. Pads made on a chip mounting board and chip welding points are in sequential correspondence and are connected through bonding wires, the back surface of the chip faces upwards and is fit with the chip mounting board, the front surface of the device faces downwards, the bonding wire is immobilized through an immobilization adhesive, the chip and the bonding wire are thus in astable state, the center hollow area of the chip mounting board can expose the back surface of the chip, and when the mounting board is arranged on a clamp through leading-out pins, the hollow area faces upwards, the back surface of the chip faces upwards, and thus, the back surface incidence requirement in the pulsed laser single particle test can be met. The test can be ensured to be smoothly carried out, and effectiveness of a test result can be ensured.

Description

technical field [0001] The invention relates to a pulsed laser single particle test device and a test method of a bare chip, and belongs to the technical field of semiconductor device anti-space single particle effect detection technology. Background technique [0002] When a semiconductor device is used in a space environment, space high-energy particles will penetrate the interior of the semiconductor device and generate ionization on the path, and the circuit nodes will absorb the electrons and holes generated by the ionization to cause errors. This effect is called single event effect. The ability to verify the anti-single event effect of semiconductor devices on the ground mainly relies on ground heavy ion accelerators to simulate single event experiments, but the resources of heavy ion accelerators are limited. The machine time for carrying out single event experiments on aerospace components is far from meeting the demand. Pulsed laser simulation of single event effe...

AI Technical Summary

Problems solved by technology

[0005] The single event effect simulation test based on the existing pulsed laser test conditions mainly has the following two shortcomings: First, after the conventional device is uncapped, there is a metal layer on the front of the chip, which will block the incident laser light. Due to the reflection and scattering of the metal layer, the incident Laser energy loss cannot be quantitatively evaluated, thus increasing the uncertainty of test results; second, there are only a few flip-chip devices at present, and the device can be directly incident after the cap is removed, but the substrate thickness of the device needs to be measured in advance to calculate the effective laser incident energy. Accurately evaluate the anti-single particle ability of the device, but there are relatively few such devices, and the engineering promotion of the pulsed laser simulation single particle test method still needs to be prepared for the applicability test sample

Images