The application discloses a method for removing
electroplating process wires by
laser, comprising the following steps: step (1), according to the state of the existing process wires after
electroplating, designing reasonable half-
cut laser processing path and hot-pressing
laser processing path; step (2), according to the half-
cut laser path,
cutting the
metal layer of the process wires by laser, and basically not damaging the underlying substrate; step (3), according to the hot-pressing
laser processing path, using the
thermal effect of laser to heat the process wires, and then reducing the adhesion between the process wires and the substrate, and meanwhile, a certain
positive pressure blowing or / and negative pressure suction is used to make the process wires separate from the substrate. The method does not need traditional manual picking to remove the process wires, does not need secondary
etching, has no protective material
coating process, and can adopt laser direct stripping to remove the process wires; the method is accurate in positioning, has no burr on the edge, has no side
etching, is good in consistency, is high in
processing efficiency, is low in cost, and is simple in operation, and is low in skill requirement for employees.