Manufacturing method of golden fingers at ladder position

Abstract

The invention relates to the field of printed circuit boards, and specifically relates to a manufacturing method of golden fingers at a ladder position. The surface of a ladder position area is attached with a high temperature protection adhesive tape, golden finger patterns and golden finger leads arranged inside the ladder position area are covered with the high temperature protection adhesive tape, then core plates or multiple laminated daughter boards above the high temperature protection adhesive tape in the ladder position area are removed after the working procedure of lamination, nickel and gold electroplating is carried out on the gold finger patterns after the high temperature protection adhesive tape is torn off to prepare the golden fingers, the surface completeness of the golden fingers is guaranteed, contamination or scratching is avoided, so that the completeness of signal transmission is guaranteed. Simultaneously, prepregs are used for replacing prepregs without gumming, the problem of hollow resin, between two layers of the ladder position, caused by excessive glue insufficiency is avoided, the problem that the binding force among the core plates at the ladder position is insufficient is solved, and the quality of a PCB is integrally improved.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for manufacturing stepped golden fingers. Background technique [0002] As the market's demand for small electronic products continues to rise, in order to reduce the thickness of the product, some electronic devices are inserted into the circuit board, and some areas of the circuit board are recessed into the board to form a circuit board with a stepped area. A multilayer printed circuit board with slots is called a ladder circuit board. The stepped circuit board not only has the advantage of maximizing the use of the space inside the circuit board, but also has the advantage of avoiding other components when soldering components to ensure the safety of electrical components. [0003] In order to meet the use requirements of the circuit board, it is necessary to make golden fingers on the stepped position of the stepped circuit board. The current commonly used met...

AI Technical Summary

Problems solved by technology

This method of making the gold finger first and then cutting the stepped position is easy to pollute or scratch the surface of the gold finger during the controlled depth milling process of the copper foil or core board above the gold finger, affecting the integrity of signal transmission

At the same time, the use of non-flowing prepregs in the lamination process often results in voids between the step and the upper layer due to insufficient glue flow, resulting in insufficient bonding force between the two core boards, which affects the quality of the high-layer board

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