A fast heat dissipation pcb
A fast, heat sink technology, applied in the direction of circuit heating devices, printed circuit components, printed circuits, etc., can solve the problem of low heat dissipation performance of PCB, and achieve the effect of improving heat dissipation performance, reducing the overall structure size, and compacting the overall structure
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Embodiment 1
[0039] see Figure 1-2 As shown, this embodiment provides a PCB with rapid heat dissipation, and the PCB is formed by laminating three core boards, but the number is not limited thereto. The schematic diagram of slotting on the PCB is as follows figure 1 As shown, the PCB is provided with a non-metallized stepped groove 1, which includes a through groove 11 on the upper part of the PCB and a groove 12 on the lower part, both of which form a convex stepped groove 1. see figure 2 , the PCB also includes a heat dissipation substrate, and the heat dissipation substrate may be a metal block 2 with high thermal conductivity. Wherein, the through groove 11 is used for accommodating high-power components 3, and a conductive and thermally conductive adhesive sheet 4 is arranged between the high thermally conductive metal block 2 and the metal layer 10 adjacent to its upper surface, and the high-power component 3 is bonded to the conductive and thermally conductive Solder paste 5 is...
Embodiment 2
[0048] Such as Figure 3-4 As shown, on the basis of the above-mentioned first embodiment, this embodiment differs from the above-mentioned first embodiment in that a recess is provided on the upper surface of the above-mentioned high thermal conductivity metal block 2, and the above-mentioned recess is used to accommodate high-power components 3 The bottom of the high-power component 3 is provided with solder paste 5 except between the conductive and thermally conductive adhesive sheet 4 and the metal layer 10 adjacent to the upper surface of the conductive and thermally conductive adhesive sheet 4. The high-power component 3 and the high-power Solder paste 5 is also arranged between the recesses of the heat conducting metal block 2 .
[0049] Such as image 3 As shown, the heat generated by the high-power components 3 is mainly transferred through the high-thermal-conductivity metal block 2 , and this heat transfer path is the main heat dissipation path of the high-power co...
Embodiment 3
[0052] Such as Figure 5 As shown, on the basis of the second embodiment, the present embodiment differs from the second embodiment above in that the rapid heat dissipation PCB in the present embodiment is formed by laminating four core boards.
[0053] The difference from the above-mentioned second embodiment is that the through groove 11 runs through the upper core board, the groove 12 runs through the lower three core boards and the prepregs adjacent to the lower three core boards, and the high thermal conductivity metal block 2 is arranged in the concave in slot 12.
PUM
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Abstract
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