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ANN-based radio frequency power amplifier interconnection reliability modeling method

A modeling method and radio frequency power amplifier technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of high computer memory requirements, complex simulation process, time-consuming and other problems, to overcome time-consuming and resource-consuming , Fast and accurate analysis and prediction, the effect of strong realistic guidance

Inactive Publication Date: 2018-04-13
TIANJIN UNIV
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  • Application Information

AI Technical Summary

Problems solved by technology

However, the simulation process of this method is very complicated, takes a lot of time and requires very high computer memory.

Method used

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  • ANN-based radio frequency power amplifier interconnection reliability modeling method
  • ANN-based radio frequency power amplifier interconnection reliability modeling method
  • ANN-based radio frequency power amplifier interconnection reliability modeling method

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Embodiment

[0059] The present invention proposes a method for modeling the interconnection reliability of radio frequency power amplifiers based on artificial neural network technology, now in conjunction with GaAs (gallium arsenide) MMIC (monolithic microwave integrated circuit) PA (power amplifier) ​​the present invention is carried out in detail illustrate.

[0060] First, FEA calculation is used to generate certain training data and test data, which can be expressed as (x k , d k )k=1, 2, 3...p, where x k is the input, d k is the output of the original circuit, and p is the total number of training data.

[0061] Then, the obtained training data and test data are used for training and testing of ANN respectively, and the ANN model is established.

[0062] (1) Define the input of the ANN model: in the ANN model of the RF power amplifier, temperature T, current I and gate width W are selected as the input variables of the model, where temperature and current can be set in the simul...

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Abstract

The invention discloses an ANN-based radio frequency power amplifier interconnection reliability modeling method. According to the method, FEA calculation is adopted to generate training data and testdata; the training data and the test data are used for training and testing of an ANN respectively, and an ANN model is established; the ANN model is utilized to generate radio frequency power amplifier interconnection reliability data and establish a radio frequency power amplifier interconnection reliability database; and the radio frequency power amplifier interconnection reliability databaseis utilized to analyze interconnection reliability of radio frequency power amplifiers and influences of various factors on the interconnection reliability of the radio frequency power amplifiers. Through the method, the ANN is introduced into a radio frequency power amplifier interconnection reliability model research process, and before ANN model establishment is fully utilized, empirical knowledge relevant to a mechanism of a modeled object and an input / output relation is not needed, additional definition is not needed either, and therefore radio frequency power amplifier interconnection reliability modeling analysis efficiency is improved.

Description

technical field [0001] The invention relates to the field of reliability modeling of radio frequency power amplifier interconnection, more specifically, relates to an ANN-based method for modeling reliability of radio frequency power amplifier interconnection. Background technique [0002] Studies have shown that there are many reasons for the failure of RF integrated circuits, among which improper design accounts for about 43%, improper maintenance accounts for about 30%, manufacturing-related problems account for about 20%, and other reasons account for about 7%[1]. From the literature [1] we know that interconnection failure is one of the most important reasons for the failure of radio frequency integrated circuits. With the continuous improvement of the integration level of radio frequency integrated circuits and the gradual reduction of interconnection width, the area and cost of metal interconnection are getting higher and higher, and most of the chip manufacturing pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/367G06F30/392
Inventor 马建国周绍华傅海鹏
Owner TIANJIN UNIV
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