A kind of preparation method of electrode of high-frequency surface acoustic wave device

Abstract

The invention discloses a method for preparing an electrode of a high-frequency surface acoustic wave device. The steps include: S1. Exposing the contour of the interdigitated electrode in the electrode to be prepared by using a negative glue on a substrate substrate of a piezoelectric functional material; S2. Exposure and development After metal deposition, a metal coating with an interdigitated electrode contour pattern is obtained; S3. Mechanically peel off the redundant metal layer outside the contour pattern to obtain the final dense pattern corresponding to the interdigitated electrode; S4. Use positive glue to prepare The bus bars and pads in the electrodes are exposed and metal deposited; S5. The redundant metal layer is stripped off the deposited metal layer using a stripping process to obtain electrode patterns corresponding to the bus bars and pads, and the preparation of the electrodes is completed. The invention can prepare nano-scale SAW device electrodes with high-resolution dense patterns and large-size patterns, and has the advantages of simple operation, low cost, high preparation efficiency and yield, high-quality SAW electrodes, good versatility, and the like.

Description

technical field [0001] The invention relates to the technical field of micro-nano processing of nano-electronic components, in particular to a method for preparing electrodes of high-frequency surface acoustic wave devices. Background technique [0002] SAW (Surface Acoustic Wave, Surface Acoustic Wave) technology is widely used in cutting-edge scientific research and industrial equipment, such as signal processing, sensing, microwave communication, non-destructive testing, etc. Plays an important role in the field of quantum research. With the surge of information, improving the operating frequency of SAW devices has become a research hotspot. In order to increase the operating frequency of SAW devices, an important technical approach is to improve the resolution of the interdigital electrodes of the device. At present, the industry prepares high-resolution micro-nano pattern structures. Planar printing technology is used, and the process equipment includes mask exposure, ...

AI Technical Summary

Problems solved by technology

[0005] (2) The resolution of a single line of EBL can reach below 10nm, but the interdigitated electrode in the SAW device is a densely distributed metal line array, which is a high-resolution, high-density pattern, while the traditional EBL exposure is completed by point-by-point scanning. When the point-by-point scanning method is used for high-resolution dense graphics, the exposure dose is very large, and it will cause serious proximity effects, thereby limiting the resolution. Therefore, it is usually difficult for SAW device electrodes prepared by EBL technology to meet the preparation index;

[0006] (3) In order to reduce the exposure area and improve the efficiency, positive photoresist technology is usually used for exposure, but the hardness of this kind of photoresist is not high, especially when preparing high-resolution structures, it is easy to be affected by capillary action and collapse, resulting in failure of preparation and lower yield;

[0007] (4) SAW electrodes also include bus bars and pads. This type of structure is much larger than the size of interdigitated electrodes, often hundreds of microns. Therefore, the preparation of this large-scale electrode pattern will greatly consume EBL operation time and cost High but low economic benefits, output-to-input ratio is usually extremely low

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