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FP and II-type FBG combined sensor for high temperature strain measurement

A composite sensor and high-temperature strain technology, which is applied in the direction of measuring devices, instruments, and optical devices, can solve the problems of poor test stability of resistance strain gauges, low survival rate, and the resistance value of resistance strain gauges is greatly affected by temperature.

Inactive Publication Date: 2018-04-17
BEIJING INFORMATION SCI & TECH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The strain electrical measurement system based on the resistance strain gauge, in the temperature environment higher than 500 ℃, after being interfered by electromagnetic radiation, the test stability of the resistance strain gauge is poor, the survival rate is also low, and the resistance value of the resistance strain gauge Highly affected by temperature

Method used

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  • FP and II-type FBG combined sensor for high temperature strain measurement
  • FP and II-type FBG combined sensor for high temperature strain measurement
  • FP and II-type FBG combined sensor for high temperature strain measurement

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Embodiment Construction

[0032] The objects and functions of the present invention and methods for achieving the objects and functions will be clarified by referring to the exemplary embodiments. However, the present invention is not limited to the exemplary embodiments disclosed below; it can be implemented in various forms. The essence of the description is only to help those skilled in the relevant art comprehensively understand the specific details of the present invention.

[0033] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the same reference numerals represent the same or similar components, or the same or similar steps.

[0034] figure 1 Shown is a schematic structural view of the composite sensor of the present invention, wherein the composite sensor includes a first FBG optical fiber 101 , a second optical fiber 105 , a pure silica capillary 102 , ceramic glue 103 and a gold coating layer 104 .

[0035] ...

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Abstract

The invention discloses an FP and II-type FBG combined sensor for high temperature strain measurement. The FP and II-type FBG combined sensor for high temperature strain measurement includes a first FBG optical fiber, a second optical fiber, a pure quartz capillary tube and ceramic adhesive. The ceramic adhesive adopted by the sensor effectively encapsulates a II-type FBG sensor and an FP sensor,the II-type FBG sensor is used for temperature measurement, the FP sensor is used for temperature and strain measurement, and through spectral information demodulated in a spectrometer, separation oftemperature and strain can be achieved. The optical fibers and the ceramic adhesive which are adopted in the method can both work in a high temperature environment, and temperature and strain measurement at 1000 DEG C of high temperature can be achieved.

Description

technical field [0001] The invention relates to the field of optical fiber sensing, in particular to an FP and type II FBG composite sensor for high temperature strain measurement. Background technique [0002] Strain refers to the degree of deformation of a material under the action of factors such as external force and non-uniform temperature field. High-temperature strain measurement refers to the strain measurement of the measured object whose working temperature is higher than 500°C, such as the strain measurement of aircraft engines, nuclear power engines, and supercritical generators under working conditions. [0003] The strain electrical measurement system based on the resistance strain gauge, in the temperature environment higher than 500 ℃, after being interfered by electromagnetic radiation, the test stability of the resistance strain gauge is poor, the survival rate is also low, and the resistance value of the resistance strain gauge It is greatly affected by t...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/16
CPCG01B11/16
Inventor 张钰民祝连庆董明利娄小平宋言明李红孙广开
Owner BEIJING INFORMATION SCI & TECH UNIV