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Micro voltage high overload sensor chip

A sensor chip, high overload technology, applied in instruments, measuring fluid pressure, measuring fluid pressure through electromagnetic components, etc., can solve the problem of contradiction between sensitivity and overload impedance, and achieve the effect of improving strain and sensitivity

Active Publication Date: 2018-04-20
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The invention provides a micro-voltage high-overload sensor chip, which is dedicated to solving the problem of contradiction between sensitivity and overload impedance caused by overlapping of stress-sensitive area and high-stress area caused by overload in the prior art

Method used

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Embodiment Construction

[0042] In order to better explain the present invention and facilitate understanding, the present invention will be described in detail below through specific embodiments in conjunction with the accompanying drawings.

[0043] refer to Figure 1 to Figure 6 , In this embodiment, a micro-voltage high overload sensor chip is provided. The sensor chip includes a substrate 3, a device layer 2 and an oxide layer 1 stacked in sequence from bottom to top, and the three form an integrated device. It should be noted that the micro pressure range referred to here is 0-500Pa; the high overload range referred to here is 200-500 times the full scale. The ranges of micro-pressure and high-overload specified here can be used as reference, and the specific ranges known to those skilled in the art shall prevail.

[0044] Wherein, the oxide layer 1 is a silicon dioxide insulating layer; the material of the device layer 2 is single crystal silicon; the material of the substrate 3 is preferably...

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Abstract

The invention relates to a micro voltage high overload sensor chip comprising a pedestal, a device layer and an oxidation layer that are orderly superposed from bottom to top; the chip is provided with a plurality of first upper grooves and a plurality of second upper grooves; an upper part central island, a plurality of upper part radiation islands, a plurality of sensitive beams, a plurality oflead wire beams, an annular beam and an upper substrate are formed; a lower groove, a lower part central island, a plurality of lower part radiation islands and a lower part substrate are formed on alower surface of the device layer; the pedestal is provided with via holes which the lower part central island and the lower part radiation islands can freely enter when moving down. The micro voltagehigh overload sensor chip can help solve a problem of contradiction between the sensitivity of sensors and overload impedance caused by overlapping of a stress sensitive zone and a high stress zone based on conventional technologies, synchronous improvement of sensitivity and overload impedance can be facilitated, and dynamic characteristics of the sensors can be remarkably improved.

Description

technical field [0001] The invention belongs to the technical field of piezoresistive pressure sensors, and in particular relates to a micro-pressure high-overload sensor chip. Background technique [0002] With my country's vigorous promotion of the key development areas of the manufacturing industry, sensors have attracted much attention as an essential basic technology and equipment core. The demand is urgent, and it has become a research hotspot at home and abroad. [0003] In the field of aerospace, micro-pressure sensors have the characteristics of high reliability and concealment, and are indispensable in monitoring the altitude of the aircraft in a near-vacuum environment, ensuring accurate adjustment of the flight track, and ensuring flight safety. Accurate measurement of barometric altitude information puts forward higher requirements on sensor sensitivity. At the same time, due to the large air pressure difference between the ground and high altitude, the small-r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L9/00
CPCG01L9/0055
Inventor 于忠亮宋锦春
Owner NORTHEASTERN UNIV
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