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LED package body and high-light-transmittance LED lamp

A technology of LED packages and LED chips, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of quantum efficiency reduction, reduced luminous efficiency, LED light source distribution dispersion, etc., and achieve the effect of improving luminous dispersion

Inactive Publication Date: 2018-04-20
XIAN CREATION KEJI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] LEDs that use the above method to emit light have the following defects: the distribution of light emitted by the LED light source is relatively scattered, and the illumination brightness of the light source is not good. It often needs to be shaped by an external lens to meet the brightness requirements, which greatly increases the production cost of the LED; The powder is directly coated on the surface of the chip, and the chip absorbs the scattered light, which reduces the luminous efficiency. Moreover, the high temperature of the chip will reduce the quantum efficiency of the phosphor powder, which will affect the lumen efficiency of the LED light source, which will easily lead to a decrease in light intensity. A series of problems such as spectral shift and accelerated aging of the chip reduce the service life of the LED light source

Method used

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  • LED package body and high-light-transmittance LED lamp
  • LED package body and high-light-transmittance LED lamp
  • LED package body and high-light-transmittance LED lamp

Examples

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Effect test

Embodiment 1

[0035] See figure 1 , figure 1 A schematic structural diagram of an LED package provided by the present invention, the package includes:

[0036] heat sink (21);

[0037] LED chips, arranged on the heat sink (21);

[0038] A first silica gel layer (22), coated on the LED chip and the heat sink (21);

[0039] A second silica gel layer (23), arranged on the first silica gel layer (22);

[0040] The third silica gel layer (24) is arranged on the second silica gel layer (23).

[0041] Further, on the basis of the above embodiment, the first silica gel layer (22) does not contain phosphor, and the second silica gel layer (23) or the third silica gel layer (24) contains phosphor.

[0042] In this embodiment, the LED chip is not in direct contact with the fluorescent powder, which solves the problem of the decrease in the quantum efficiency of the fluorescent powder caused by high temperature; the silica gel in contact with the LED chip is preferably high-temperature-resistant s...

Embodiment 2

[0062] See Figure 5 , Figure 5 It is a schematic flow chart of an LED packaging method provided by the embodiment of the present invention. The LED package in Embodiment 1 is prepared by the method provided in this embodiment, and the method includes:

[0063] Select the LED chip;

[0064] selecting a heat sink and cleaning said heat sink;

[0065] Welding the leads of the LED chip to the heat sink;

[0066] A silica gel layer is potted on the heat sink, so that the light emitted by the LED chip is emitted outward through the silica gel layer.

[0067] In this embodiment, the fluorescent powder is placed in the silica gel layer instead of directly coating the fluorescent powder on the LED chip, thereby avoiding the absorption of backscattered light by the LED chip and improving the light extraction efficiency of the package. In addition, the adoption of this embodiment avoids the problem that the high temperature generated by the LED chip significantly reduces the quantu...

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Abstract

The invention relates to an LED package body and a high-light-transmittance LED lamp. The LED package body comprises a heat sink (21), an LED chip arranged on the heat sink (21), a first silica gel layer (22) coated on the LED chip and the heat sink (21), a second silica gel layer (23) arranged on the first silica gel layer (22), and a third silica gel layer (24) arranged on the second silica gellayer (23). According to the LED package body, fluorescent powders thereof are separated from the LED chip, thereby solving the problems of reduction of quantum efficiency of the fluorescent powders due to high temperature and reduction of light transmittance.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, in particular to an LED packaging body and an LED lamp with high light transmittance. Background technique [0002] LED (Light Emitting Diode), light-emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. The practicality and commercialization of high-performance LEDs have brought about a new revolution in lighting technology. The pixel light composed of multiple ultra-high-brightness red, blue, and green LEDs can not only emit various colors of light with continuously adjustable wavelengths, but also emit white light with a brightness of tens to one hundred candlepower as a lighting source. For incandescent lamps and LED solid-state lighting lamps with the same luminance, the power consumption of the latter only accounts for 10%-20% of the former. [0003] Most of the white LEDs produced in reality are made by covering a layer of light ye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/50H01L33/58
CPCH01L33/56H01L33/507H01L33/58
Inventor 左瑜
Owner XIAN CREATION KEJI CO LTD
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