Easy-to-radiate combined radiator
A radiator and combined technology, applied in instruments, electrical solid devices, semiconductor devices, etc., can solve the problems of increasing the size of the heat sink and the cost of use, and achieve the effects of excellent thermal conductivity, accelerated thermal conduction, and accelerated thermal conduction.
Inactive Publication Date: 2018-04-27
成都西河散热器厂
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Problems solved by technology
[0004] Compared with copper heat sinks, aluminum alloy heat sinks are more economical. Therefore, when using aluminum alloy to make heat sinks with the same heat dissipation effect, many manufacturers reduce the temperature by increasing the volume of heat sinks, or Use an external fan to cool down, no matter which method is used, it will inevitably increase the size of the heat sink and the cost of use
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[0021] Such as figure 1 As shown, the present invention is a combined heat sink that is easy to dissipate heat. It includes a substrate 1 and a heat sink 3. The bottom of the substrate 1 is covered with a layer of copper foil. The copper foil is preferably made of oxygen-free copper, because oxygen-free copper has excellent thermal conductivity. Performance, the copper foil is placed between the heating equipment and the radiator, which speeds up the heat conduction speed between the heating equipment and the radiator, and achieves the purpose of rapid cooling. The top of the substrate 1 is arranged with a plurality of cooling fins 3 at intervals. The cooling fins 3 have a tower-shaped structure with a thin top and a thick bottom. The large area can speed up the heat conduction on the substrate 1, and the heat sink 3 quickly transfers the heat on the substrate 1 to the heat sink 3, thereby improving the heat dissipation efficiency. The left and right ends of the heat sink 3 a...
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The invention discloses an easy-to-radiate combined radiator, which comprises a substrate and radiating fins, wherein the plurality of radiating fins are arranged on the top end of the substrate at intervals, each radiating fin is of a tower structure with a thin upper part and a thick lower part, left and right ends of each radiating fin are provided with strip-shaped lug bosses, the strip-shapedlug bosses extend along the length direction of the radiating fin, and the strip-shaped lug bosses are evenly arranged on the radiating fins. According to the easy-to-radiate combined radiator, the bottom part of the substrate is covered with copper foil made of an oxygen-free copper material, since the oxygen-free copper has excellent heat conduction performance, the heat conduction speed between heating equipment and the radiator is accelerated by placing the copper foil between the heating equipment and the radiator, and the purpose of rapid cooling is achieved; and the left and right endsof each radiating fin are evenly provided with the strip-shaped lug bosses which increase the radiating area of the radiating fins, the contact area of the radiating fins and the outside is increasedon the radiator of the same size, thus the radiating efficiency of the radiator is improved, and the effect of rapid heat radiation can be achieved when not using a fan for cooling.
Description
technical field [0001] The invention relates to the technical field of equipment heat dissipation, in particular to a combined heat sink that is easy to dissipate heat. Background technique [0002] Integrated circuits are heavily used in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. The function of the radiator is to absorb the heat and then dissipate it inside or outside the case to ensure that the temperature of the computer components is normal. Most heat sinks absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distant place through various methods, such as the air in the chassis, and then the chass...
Claims
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IPC IPC(8): H01L23/373H01L23/367G06F1/20
CPCG06F1/20H01L23/367H01L23/3736
Inventor 朱敏
Owner 成都西河散热器厂