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Heat dissipator

A technology for radiators and containers, which is applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc. It can solve the problems of unsatisfactory heat dissipation of radiators, high manufacturing costs, and large space requirements. The effect of simplicity, low manufacturing cost, and high thermal conductivity

Active Publication Date: 2018-04-27
深圳市欣普斯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a heat sink that can solve the aforementioned problems in view of the problems of the existing heat sink described in the background technology, such as unsatisfactory heat dissipation effect, poor expandability, high manufacturing cost, and large space requirements.

Method used

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Effect test

Embodiment 1

[0019] Such as figure 1 with figure 2 The radiator shown includes a water supply container 1, a circulating water pump 2, a water inlet pipe 3, a water return pipe 4, and a heat conduction assembly. The water joint 7 and the water outlet joint 8 are provided with a plurality of heat conduction holes inside the heat conduction silica gel sheet 5, and the heat conduction pipe 6 includes a plurality of heat conduction pipes having the same number of heat conduction holes in the heat conduction silica gel sheet. Pass through the heat conduction hole and contact with the heat conduction hole wall for heat conduction, the water inlet joint 7 and the water outlet joint 8 are provided with interfaces corresponding to each heat conduction pipe, the water inlet joint 7 is provided with a water inlet, and the water outlet joint 8 is provided with There is a water outlet, the water inlet is connected to the water supply container 1 through the water inlet pipe 3, the water outlet is con...

Embodiment 2

[0022] In the above scheme, in order to quickly dissipate the heat in the cooling water to the external environment and cool the cooling water, the return pipe 4 is provided with a remote radiator 9, which is arranged at a position far away from the heat source, and the The heat in the return water is dissipated directly to the external environment. For example, in a computer, the remote radiator 9 is arranged on the outside of the computer, outside the chassis of the desktop computer, or outside the notebook computer. The remote radiator can directly contact the external environment, and the heat dissipation is faster, and the user You can intuitively feel the temperature of the heating element inside the computer. If the temperature of the remote radiator is high, you can implement a certain heat dissipation scheme for the remote radiator, such as water cooling, air conditioner or fan. These schemes have obvious effects and will not cause damage to the circuit. any adverse e...

Embodiment 3

[0024] A specific solution, the said distal heat sink 9 is a metal piece, and its surface is provided with a concave-convex structure to increase the heat dissipation area. The concave-convex structure can be surface protrusions and grooves, or heat dissipation fins. There is a water channel inside, and the water channel can be set as multiple straight channels or a curved channel, so that the cooling water can fully contact the metal parts, and the heat in the cooling water can be transferred to the metal parts. The cooling water is transported to the water supply container 1 through the water return pipe 4 after passing through the metal parts for heat dissipation.

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Abstract

The invention discloses a heat dissipater, comprising a water supply container, a circulation water pump, a water inlet pipe, a water return pipe and a heat conduction assembly. The heat conduction assembly comprises a heat conduction silica gel sheet, heat conduction pipes, and a water inlet joint and a water outlet joint which are connected with two ends of the heat conduction pipes. A pluralityof heat conduction holes are set in the heat conduction silica gel sheet. The heat conduction pipes penetrate from the heat conduction holes on the heat conduction silica gel sheet and contact with walls of the heat conduction holes, thereby conducting heat. Connectors corresponding to the heat conduction pipes are set on the water inlet joint and the water outlet joint. A water inlet is set on the water inlet joint. A water outlet is set on the water outlet joint. The water inlet is connected with the water supply container through the water inlet pipe. The water outlet is connected with thewater supply container through the water return pipe. Water circulation between the water supply container and the heat conduction pipes is realized through the circulation water pump. The heat dissipater provided by the invention is simple in structure and high in heat conduction rate; a circuit is prevented from being influenced by dust; the production cost is low; a size of the heat conductionassembly is small; the expandability is high; and an application range is relatively wide.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a radiator for heat dissipation of heating elements on a circuit board. Background technique [0002] In the prior art, there are mainly three ways to dissipate heat from the heating element on the circuit board, one is an air-cooled radiator, the other is a water-cooled radiator, and a hybrid radiator combining the two. The air-cooled heat dissipation relies on the rotation of the fan , the heat of the heating element is transmitted to the external environment through the wind. The disadvantage of the air-cooled radiator is that it is noisy, and the radiator is easily covered with dust, resulting in circuit failure. Moreover, for the heating element with high power, the heat dissipation effect is poor; the water-cooled radiator is The heat of the heating element is transferred to the water tank through water circulation, but after the water-cooled radiator works for a certain per...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272H05K7/20281
Inventor 刘西阁
Owner 深圳市欣普斯科技有限公司