Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Tin paste agitator for production of LED (light-emitting diode) circuit boards and agitation method

A technology for LED circuit boards and mixers, which is applied in the direction of mixer accessories, chemical instruments and methods, mixers, etc., can solve problems affecting the processing of LED circuit boards, oxidative deterioration of solder paste, and uneven mixing, so as to achieve good sealing performance and avoid Sedimentation, effect of improving stirring efficiency

Inactive Publication Date: 2018-05-01
董桂芳
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are two existing solder paste stirring methods, manual stirring and its stirring. Manual stirring often causes uneven stirring, which affects the processing of LED circuit boards. For machine stirring, there is also uneven stirring. Moreover, the solder paste cannot be exposed to the air, and it is easy to oxidize and deteriorate the solder paste in contact with the air. Therefore, we propose a solder paste mixer and mixing method for LED circuit board production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tin paste agitator for production of LED (light-emitting diode) circuit boards and agitation method
  • Tin paste agitator for production of LED (light-emitting diode) circuit boards and agitation method
  • Tin paste agitator for production of LED (light-emitting diode) circuit boards and agitation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-5 , the present invention provides a technical solution: a solder paste mixer for LED circuit board production, including a bottom plate 1, and feet 2 are provided at the four corners of the bottom of the bottom plate 1 to provide stability for the device. The left and right sides of the top of the bottom plate 1 are Pillars 7 are installed, and support bearings 8 are installed symmetrically on the tops of the opposite inner walls of the t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a tin paste agitator for the production of LED (light-emitting diode) circuit boards in the technical field of LEDs. Pillars are mounted on the left side and the right side ofthe top of a base plate, wherein supporting bearings sleeve the outer ends of supporting shafts, moreover, the two sets of supporting shafts are symmetrically arranged on the outer wall of a base, anagitating tank is arranged in an inner cavity of the base, a top sealing cover is arranged on the top of the agitating tank through hinges, a feed pipe and an agitating motor are respectively arrangedon the left side and the center of the top of the agitating tank, furthermore, both the feed pipe and the agitating motor are arranged in an inner cavity of the top sealing cover, and an agitating shaft is connected to the bottom power end of the agitating motor through a coupling. The sealing performance of the tin paste agitator is good; by arranging the top sealing cover, the feeding pipe andthe agitating motor having the possibility of air leakage are wrapped in a sealed space in the process of agitation, consequently, a good sealed environment is provided for the agitating tank, and tinpaste is prevented from being in contact with the air to cause the phenomenon of tin paste oxidation and affecting the quality of the tin paste in use.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a solder paste mixer and a mixing method for producing LED circuit boards. Background technique [0002] LED circuit board is the abbreviation of printed circuit board. Both LED aluminum substrate and FR-4 fiberglass circuit board belong to PCB. To say the difference, just compare LED aluminum substrate and FR-4 fiberglass circuit board. The circuit is printed on the aluminum material with better thermal conductivity, and then the electronic components are soldered on it. When processing the LED circuit board, it is necessary to use a very important and indispensable raw material, which is solder paste. The solder paste itself is composed of tiny Composed of metal alloy and flux, the solder paste needs to be stored in a lower temperature environment during long-term transportation, and the metal alloy particles are easy to sink into the bottom of the paste. It is used in the process...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B01F11/00
CPCB01F31/26B01F2035/351
Inventor 董桂芳
Owner 董桂芳
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products