Evaporation equipment and evaporation method using the equipment
A technology of evaporation and equipment, which is applied in the field of evaporation equipment and evaporation with a fluid disturbance device, and can solve problems such as poor density of atomic layer films
Active Publication Date: 2020-05-22
IND TECH RES INST
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Problems solved by technology
[0004] The purpose of the present invention is to solve the problem of poor compactness of the atomic layer film produced by the evaporation machine, and to provide the evaporation space and the way of disturbing the fluid to increase the particle kinetic energy and flux of the evaporation source material, which can increase the evaporation source The effective utilization of materials, reducing the high energy of heating caused by material cracking, etc.
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[0032] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.
[0033] Please refer to figure 1 , an evaporation device according to an embodiment of the present invention. The present invention discloses an evaporation equipment 100, as figure 1 stereogram with figure 2 As shown in the schematic side view of , it includes an evaporation chamber 110 , an evaporation source 120 , a carrying device 130 and a fluid disturbance device 140 . The evaporation chamber 110 defines an evaporation space S. The evaporation source 120 is disposed at one end of the evaporation chamber 110 , that is, below the evaporation space S, and the carrying device 130 is disposed opposite to the evaporation source 120 . The carrying device 130 is disposed above the evapor...
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The invention discloses an evaporation equipment and an evaporation method using the equipment, comprising an evaporation chamber, an evaporation source, a carrying device and a fluid disturbance device. The evaporation chamber has an evaporation space, the evaporation source is arranged below the evaporation space, and the evaporation source is suitable for containing the evaporation source material. The carrying device is centered on a reference axis, rotatably arranged above the evaporation space, and is opposite to the evaporation source; the carrying device is suitable for carrying the object to be plated and makes the object to be plated between the evaporation source and the carrying device . The fluid disturbance device is suitable for injecting a disturbed fluid towards the carrying device in the evaporation space.
Description
technical field [0001] The invention relates to an evaporation equipment and an evaporation method using the equipment, and in particular to an evaporation equipment and an evaporation method with a fluid disturbance device. Background technique [0002] The evaporation process is a widely used thin film deposition technology. Existing evaporation equipment includes an evaporation chamber, a carrying device disposed in the evaporation chamber, and an evaporation source opposite to the carrying device. The evaporation source may carry an evaporation material. During the vapor deposition process, the vapor deposition material is volatilized or sublimated by heating and filled in the vapor deposition chamber in the form of vapor deposition particles. At the same time, when the object to be evaporated is installed on the carrying device, the evaporation particles filled in the evaporation chamber can accumulate on the surface of the object to form an evaporated film. [0003]...
Claims
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IPC IPC(8): C23C14/24
CPCC23C14/228C23C14/24C23C14/505C23C14/243
Inventor 黄智勇林士钦王庆钧
Owner IND TECH RES INST