Packaging structure and method for light-emitting element
A packaging structure and light-emitting element technology, which is applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., can solve the problems of poor airtightness of the packaging structure, and achieve the effects of avoiding falling off, improving airtightness, and simple and easy packaging structure
Active Publication Date: 2020-08-11
NANJING TECH CORP LTD
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The main purpose of the present invention is to provide a packaging structure and method for light-emitting elements to solve the problem of poor airtightness of the packaging structure of electroluminescent devices in the prior art
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0066] like Figure 4 As shown, the TFT substrate is prepared, and the TFT unit 32 and the silicon dioxide or silicon nitride protective layer 33 have been fabricated on the glass substrate body 31, with a thickness of 20nm, and the protective layer 33 has been etched with ITO via holes or openings. , and then use wet photolithography to make a sub-pixel photoresist insulating layer 6 directly above the corresponding TFT unit 32 on the protective layer 33, the thickness of the photoresist is 0.8um, and the photoresist insulating layer is on the surface of the TFT substrate 6 and on the protective layer 33, sputter ITO transparent conductive film with a thickness of 35nm, etch the ITO, retain the ITO on the TFT substrate corresponding to the edge packaging area and the sub-pixel area, and form the connection enhancement layer 2 and the first electrode unit 411 respectively, wherein , the light-emitting area includes a sub-pixel area, and the edge packaging area surrounds the li...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides a packaging structure and method for a light-emitting element. The packaging structure includes: a TFT substrate, a light-emitting element and a connection enhancement layer. The TFT substrate includes a substrate body and a TFT unit. The surface of the TFT substrate has a protective layer and the protective layer has openings at each TFT unit. The first electrode layer, the light-emitting layer and the second electrode layer, the first electrode layer includes a plurality of first electrode units, each first electrode unit is electrically connected to the electrodes of each TFT unit through openings, and the light-emitting layer is connected to each first electrode unit Electrical connection, the second electrode layer formed by Al or Ag is electrically connected to the entire surface of the light-emitting layer, the connection enhancement layer is arranged on the surface of the substrate, and its material includes metal oxide, and the second electrode layer is sealed and connected to the surface of the TFT substrate through the connection enhancement layer , to package light-emitting elements. The package structure improves airtightness.
Description
technical field [0001] The present invention relates to the field of packaging technology, in particular, to a packaging structure and method for light-emitting elements. Background technique [0002] With the development of science and technology, electroluminescent devices have entered people's field of vision as a new generation of display and lighting products due to their advantages such as high color gamut and good luminous uniformity. The main light-emitting materials in electroluminescent devices, such as organic substances or quantum dots, are easy to Corrosion by water and oxygen affects the service life of the final product. Therefore, packaging technology has an important impact on the long-term effective use of electroluminescent devices. [0003] like figure 1 As shown, the existing electroluminescent device packaging structure mostly uses glass or iron sheet as the back cover 1', and uses UV glue 2' to package the TFT substrate 3' and the back cover 1', and t...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/12H10K50/805H10K50/844H10K71/00
Inventor 任华进
Owner NANJING TECH CORP LTD