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1.5mil circuit board-based line compensation method

A line compensation and circuit board technology, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, can solve problems such as inconsistent line widths, and achieve the effect of ensuring uniformity

Inactive Publication Date: 2018-05-11
TIGERBUILDER CIRCUIT SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since all lines in the traditional production method are compensated according to the same specification, after compensation, there is a phenomenon that the width of the lines in different positions of the lines is inconsistent

Method used

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  • 1.5mil circuit board-based line compensation method
  • 1.5mil circuit board-based line compensation method
  • 1.5mil circuit board-based line compensation method

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] Such as figure 1 Shown, for a kind of line compensation method based on 1.5mil circuit board of the present invention, comprise the steps:

[0030] S1: Paste a layer of cured photosensitive film that can be cured by ultraviolet light on the outer surface of the circuit board;

[0031] S2: Draw the designed circuit pattern on the photo film through the photoplotter, then cover the photo film on the circuit board pasted with the cured photosensitive film...

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Abstract

The invention discloses a 1.5mil circuit board-based line compensation method. The 1.5mil circuit board-based line compensation method comprises the following steps of S1, pasting a layer of curing photosensitive film which can be cured by ultraviolet light onto an outer surface of a circuit board; S2, drawing the designed circuit pattern onto a photographic plate by a photoplotler, covering the photographic plate on the circuit board pasted with the curing photosensitive film, giving out high-intensity light to irradiate the curing photosensitive film by an exposure machine; S3, etching the developed circuit board, performing dynamic compensation on the basis of universal production compensation according to circuit distribution conditions of different regions so that the width uniformityof the finished line is ensured; S5, allowing the etched circuit board to enter a film removal medium; and S6, washing and drying the circuit board. Classified compensation is performed on differentregions by employing a dynamic compensation technology, and the uniformity of the finished line can be ensured.

Description

technical field [0001] The invention relates to the technical field of circuit board preparation, in particular to a circuit compensation method based on a 1.5mil circuit board. Background technique [0002] With the development of electronic products in the direction of lightness, thinness, shortness, and smallness, the technical requirements for circuit boards continue to improve, and making circuits more dense and finer is an important part of fulfilling the above requirements. [0003] Smart phones are the current development trend of the mobile phone industry. Because of their powerful functions, smart phones have higher requirements for mobile phone circuit boards. At present, the mobile phone industry, such as Apple, Samsung and other large foreign communication companies, are developing and designing smart phone products Electronic products with 1.5mil (line width / spacing) lines. Domestic communication terminal companies such as Huawei, Xiaomi, and ZTE are also devel...

Claims

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Application Information

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IPC IPC(8): H05K3/06
Inventor 陈斌廖鑫胡刚曾亮
Owner TIGERBUILDER CIRCUIT SUZHOU
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