Composite polishing solution and preparation method thereof

A composite polishing and polishing liquid technology, which is applied in chemical instruments and methods, polishing compositions containing abrasives, and other chemical processes, can solve the problems of reducing the polishing effect and rate, hindering the formation of particle clusters, etc., to ensure the polishing effect And the effect of speed and good dispersion

Active Publication Date: 2018-05-15
深圳市永霖科技有限公司
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  • Abstract
  • Description
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Problems solved by technology

In order to avoid the agglomeration of silica nanoparticles, it can be modified on the surface. Although the modified silica nanoparticles can be better dispersed in the polymer, it hinders the formation of particle clusters and reduces the polishing efficiency. effect and rate

Method used

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  • Composite polishing solution and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1~4

[0038] Configure the polishing liquid, add abrasive grains and water (if necessary) into the base liquid in batches, and continue to ultrasonically disperse during the addition. The average particle size of the Class I abrasive grains is 20 microns; the average particle diameter of the Class II abrasive grains 5 microns; the average particle size of grade III abrasive grains is 2 microns, and the polishing liquid 1~4 is obtained. Put the polishing liquids 1 to 4 in the shear thickening polishing equipment to polish the alumina ceramic curved surface workpiece, use the fixture to clamp the alumina ceramic curved surface workpiece to immerse it in the polishing liquid located in the liquid tank, fix the liquid tank, And the fixture is rotated at a speed of 100r / min, and the treatment time is 30min. The surface roughness Ra of the alumina ceramic curved surface workpiece is 129.6nm before treatment, and the results after polishing are shown in Table 1 below:

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Abstract

The invention relates to a composite polishing solution and a preparation method thereof, and belongs to the field of precise processing. The composite polishing solution is characterized by being prepared from the following ingredients in percentage by mass: 1 to 25 percent of abrasive material particles and 75 to 99 percent of base liquid, wherein the abrasive material particles consist of firststage abrasive particles, second stage abrasive particles and third stage abrasive particles according to the mass ratio of 1:(0.5 to 2):(0.5 to 5); the average particle diameter of each stage of abrasive particles is 0.5 to 50 micrometers; the particle diameter of the first stage abrasive materials is greater than that of the second stage abrasive particles; the particle diameter of the second stage abrasive particles is greater than that of the third stage abrasive particles; the three kinds of abrasive particles are respectively and independently selected from diamond particles, cube BN particles and SiC particles. The polishing liquid is prepared from 1 to 25 percent of abrasive material particles and 75 to 99 percent of base liquid in percentage by mass. The abrasive material particles comprise three stages of abrasive particles; the average particle diameters of the abrasive particles are different; bulges at different degrees on the surface of the materials can be effectively removed.

Description

technical field [0001] The invention relates to a composite polishing liquid and a preparation method thereof, belonging to the field of precision machining. Background technique [0002] At present, commonly used polishing methods include chemical polishing, mechanical polishing, electrolytic polishing, ultrasonic polishing, magnetic grinding polishing, chemical mechanical polishing, etc., among which, some methods, such as mechanical polishing and chemical mechanical polishing, are only applicable to Planar flattening polishing, not suitable for polishing curved surface workpieces. Other polishing methods that can be used on curved surfaces have their own problems. Such as magnetic grinding and polishing, the polishing method is to use magnetic abrasives to form abrasive brushes under the action of a magnetic field to grind the workpiece. This method has high processing efficiency, good quality, easy control of processing conditions, and good working conditions, but it r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02C09K3/14
CPCC09G1/02C09K3/1409
Inventor 蒋秋菊
Owner 深圳市永霖科技有限公司
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