A method for manufacturing a pdms substrate base for thin film microfluidic chip bonding
A technology of microfluidic chip and manufacturing method, which is applied to laboratory containers, chemical instruments and methods, laboratory utensils, etc., can solve the problems of high cost and long manufacturing method cycle, and achieve low cost, short cycle, Effect of Uniform Die Bonding
Active Publication Date: 2020-04-28
DALIAN UNIV OF TECH
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Problems solved by technology
The manufacturing method of this substrate base has long period and high cost
Method used
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[0018] Embodiments of the present invention will be described in detail below in conjunction with technical solutions and drawings.
[0019] as attached figure 1 , 2 As shown in and 3, at room temperature, mix the PDMS prepolymer and the curing agent according to the volume ratio of 10:1, and stir well, then put it in a vacuum oven for degassing, until there are no bubbles in the PDMS mixed solution So far, this process takes about 30 minutes; pour the degassed PDMS mixed solution onto the back of the polymer film substrate processed by thermoforming or rolling, and then keep it at room temperature for 48 hours, so that the PDMS mixed solution Completely cured; use tweezers etc. to gently peel off the cured PDMS from the back of the polymer film substrate to obtain the PDMS substrate base for bonding thin film microfluidic chips.
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The invention provides a manufacturing method of a PDMS substrate base for bonding of a thin-film microfluidic chip, and belongs to the field of micro-electromechanical systems and microfluidic chips.A processed and molded polymer film substrate is used as a mold, a degassed PDMS mixed solution is poured onto the back surface of the polymer film substrate with a casting molding process, curing ismaintained at room temperature for 48 hours, the back surface structure of the polymer film substrate is directly copied onto the surface of PDMS, and the PDMS substrate base is manufactured. The geometric shape and the size of the back surface of the thin-film substrate need not to be measured, expensive processing equipment is not needed, and the method has the advantages of simple manufacturing process, short period and low cost.
Description
technical field [0001] The invention relates to a method for manufacturing a polydimethylsiloxane (PDMS) substrate base used for bonding thin-film microfluidic chips, and belongs to the field of microelectromechanical systems and microfluidic chips. [0002] technical background [0003] Microfluidic Chip refers to a biochemical laboratory built on a chip of a few square centimeters in size. A microfluidic chip usually consists of a cover sheet and a substrate, on which a micron-sized channel network structure is processed, and then the substrate and cover sheet are bonded together to realize the sealing of the channel network structure. Microfluidic chips use the manipulation and control of the fluid in the channel to realize the functions of routine biochemical laboratories such as sample preparation, reaction, separation and detection. It has broad application prospects in many fields. [0004] The materials used to make microfluidic chips mainly include silicon, glass a...
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IPC IPC(8): B01L3/00
CPCB01L3/502707B01L2200/12B01L2300/12
Inventor 刘军山王忠宋满仓刘哲徐征李经民刘冲
Owner DALIAN UNIV OF TECH