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Device for machining automobile electronic element

A technology for electronic components and automobiles, applied in the field of processing devices for automotive electronic components, can solve problems such as high local temperature and uneven heating, and achieve the effects of improving work efficiency and reducing production costs

Inactive Publication Date: 2018-05-29
HEFEI DONGLU MACHINERY MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a device for processing electronic components of automobiles, which solves the problems of uneven heating and excessive local temperature when the device for processing electronic components of automobiles heats packaging materials

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  • Device for machining automobile electronic element
  • Device for machining automobile electronic element

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0018] see Figure 1-2 , the present invention provides a technical solution: a device for processing electronic components in automobiles, including a support base 1, a No. motor 2 is arranged on the left side of the top of the support base 1, and a No. No. gear 3 meshes with No. 2 gear 4, and No. 2 gear 4 is set on the outer wall of the rotating shaft 5. The bottom of the rotating shaft 5 is set in the fixed bearing 6, and the fixed bearing 6 is set on the t...

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Abstract

The invention discloses a device for machining an automobile electronic element. The device for machining the automobile electronic element comprises a supporting base; a first motor is arranged on the left side of the top of the supporting base; an output end of the first motor is connected with a first gear; the first gear is in engaged connection with a second gear; the second gear is arrangedon the outside wall of a rotating shaft in a sleeving manner; the bottom of the rotating shaft is arranged in a fixed bearing; the fixed bearing is arranged at the top of the supporting base; a lifting plate is arranged on the outside wall of the upper part of the rotating shaft in a sleeving manner; a guide rod is arranged on the right side of the rotating shaft; a sliding sleeve is arranged on the outside wall of the upper part of the guide rod in a sleeving manner; the sliding sleeve is arranged in the lifting plate; a supporting plate is arranged on the right side of the top end of the lifting plate. The invention relates to the technical field of automobile accessory machining. According to the device for machining the automobile electronic element, the problem of non-uniform heatingwhen a packaging material is heated by the existing device for machining the automobile electronic element is solved, and the packaging material can be heated uniformly effectively, so that the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of auto parts processing, in particular to a device for processing automotive electronic components. Background technique [0002] As we all know, a car is composed of several devices, and each car company has some parts companies that supply it, such as electronic components, frame, seat, and engine; among them, the material science and technology in the manufacturing process of automotive electronic products The basis of device manufacturing in electronic science, as well as the evolution and evolution of soldering, thin film, photolithography, micro-molding and other processes and material interfaces involved in a large number of processes in electronic packaging and micro-nano manufacturing processes must follow The basic law of the design is to wrap the designed electronic chip and electronic circuit with a specific packaging material, which can protect the circuit, and the packaging needs to heat the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29B7/14B29B7/82B29C33/22B29C33/30
CPCB29B7/14B29B7/826B29C33/22B29C33/30
Inventor 罗晓虎
Owner HEFEI DONGLU MACHINERY MFG