In-situ integrated additive manufacturing device for nano-metal circuit

Abstract

The invention discloses an in-situ integrated additive manufacturing device for a nano-metal circuit, and the device employs a modular design, achieves the high integration of an additive delivery module of nano-metal, in-situ heating, in-situ laser sintering, in-situ irradiation reduction and gas protection, and achieves the coordinative control. The device can achieve the preparation of a two-dimensional plane circuit, and also can achieve the preparation of a three-dimensional circuit which is complex in complex surface curvature and curvature changes. According to the invention, the forming, in-situ reduction and in-situ sintering of a nano-metal circuit are integrated, thereby solving a problem nano-metal oxidation, and improving the efficiency. The manufacturing shape and size are not limited by a sintering furnace, thereby enlarging the application range of an additive manufacturing method, solving a problem of non-uniform distribution metal particles in a preparation process ofa conventional nano-metall circuit or residual gaps after sintering, improving the circuit compactness and consistency, and finally obtaining a circuit with the good performances.

Description

technical field [0001] The invention belongs to the technical field of printed electronics, and mainly relates to an in-situ integrated additive manufacturing device for nanometer metal circuits. Background technique [0002] Metal wiring or electronic circuit manufacturing is very important in the electronics industry. In traditional printed circuits, photolithography is mostly used. As a "subtractive material" manufacturing technology, this technology has problems such as environmental pollution, waste of raw materials, many processes, low efficiency and yield. For the manufacture of complex electronic circuits, especially three-dimensional circuits, this technology has certain limitations. As a new manufacturing technology, additive manufacturing technology can effectively solve the above problems. As one of the important materials for additive manufacturing, nano-metal materials, especially nano-metal conductive ink / paste, have also received extensive attention and re...

AI Technical Summary

Problems solved by technology

The preparation time is long, the efficiency is low, and the size of the sintered product is also limited by the size of the sintering furnace

In addition to the above problems, many electronic circuit printings are still essentially two-dimensional plane printing, which cannot meet the needs of free design and manufacture of electronic circuits on complex three-dimensional curved surfaces.

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