Breaking method and breaking device of brittle material substrate

A technology of brittle material substrate and disconnecting device, which is applied to fine working devices, stone processing equipment, electrical components, etc., can solve the problems of easy warping of substrates, complex structure, and difficult alignment of the focus of surveillance cameras.

Active Publication Date: 2021-05-04
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the brittle material substrate is thin, the peripheral portion of the substrate tends to warp
If the brittle material substrate is warped, there is a disadvantage that it is not easy to adjust the focus of the monitoring camera when the scribe line formed on the substrate is recognized from below, and it is not easy to accurately press the disconnection lever from directly above the scribe line to disconnect Substrate
[0009] When breaking a brittle material substrate using the device of Patent Document 2, air flows into the space of the concave portion from the upper side of the substrate and presses it from the upper side, so the concave portion must be sealed, and a pump for inflowing air is required, resulting in a complicated structure. point

Method used

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  • Breaking method and breaking device of brittle material substrate
  • Breaking method and breaking device of brittle material substrate
  • Breaking method and breaking device of brittle material substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Next, an outline of the breaking device 10 used for breaking the brittle material substrate of this embodiment will be described. figure 1 It is a schematic perspective view of the breaking device according to the embodiment of the present invention, figure 2 It is a schematic side view of the disconnecting device. The breaking device 10 has a transparent glass table 12 on a base 11 that can move in the positive or negative direction of the y-axis. Below the glass table 12, the Y-axis movement mechanism 13 which moves the glass table 12 in the y-axis direction along this surface, and rotates along this surface is provided. A U-shaped frame-shaped fixing member 14 is provided on the upper side of the glass table 12 , and a servo motor 15 is held on the upper side of the frame-shaped fixing member 14 . The rotary shaft of the servo motor 15 is directly connected to the ball screw 16 , and the lower end of the ball screw 16 is rotatably supported by the horizontal fixin...

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PUM

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Abstract

The invention relates to a breaking method and a breaking device of a brittle material substrate, which hold the brittle material substrate on a cutting ring and prevent the bending of the substrate when it is carried on a workbench. A sapphire substrate (30) is held on an adhesive tape (32) attached to a dicing ring (31). An elastic support plate (40) is arranged on the glass table (12) of the breaking device, above which the cutting ring (31) is fixed. The sapphire substrate (30) is brought into close contact with the elastic support plate (40) by pushing the roller (22) against the sapphire substrate (30) and moving it relatively. Next, the scribed line is recognized by a monitoring camera, and the breaking lever is lowered from directly above the scribed line to separate the brittle material substrate.

Description

technical field [0001] The invention relates to a breaking method and a breaking device for breaking thin substrates of brittle material. Background technique [0002] When breaking a brittle material substrate, for example, as shown in Patent Document 1, a scribe line is formed on a brittle material substrate in advance, the substrate is held on a support table through a dicing ring, and the breaking lever is pressed from directly above the scribe line to remove the slit from the substrate. The upper side is disconnected. [0003] However, when the brittle material substrate is thin, the peripheral portion of the substrate tends to warp. If the brittle material substrate is warped, there is a disadvantage that it is not easy to adjust the focus of the monitoring camera when the scribe line formed on the substrate is recognized from below, and it is not easy to accurately press the disconnection lever from directly above the scribe line to disconnect substrate. [0004] I...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/78H01L21/76B28D5/00
CPCB28D5/00B28D5/0011B28D5/0058B28D5/0082H01L21/78B28D5/0041B28D5/0052B28D5/0064H01L21/76H01L21/67092
Inventor 村上健二
Owner MITSUBOSHI DIAMOND IND CO LTD
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