Steel sheet tin filling grounding process

Abstract

The invention discloses a steel sheet tin filling grounding process, comprising a steel sheet, a flexible circuit board and an electronic component arranged on the circuit board. The electronic component is located on the front of the circuit board, and the steel sheet is located on the back of the circuit board. The circuit board is provided with a through hole in the position corresponding to the electronic component. One end of the through hole is communicated with the electronic component, and the other end of the through hole is communicated with the steel sheet. After tin is poured intothe through hole, the electronic component is connected with the steel sheet. After tin is solidified on the steel sheet, the electronic component and the steel sheet are fixedly combined, a tin layeris formed between the circuit board and the steel sheet, and the steel sheet is tightly combined with the circuit board through the tin layer. Through the process, an FPC-tin layer-steel sheet structure is obtained. The grounding impedance of the FPC and the steel sheet can be greatly reduced, and the static electricity and the overall performance can be significantly improved. Moreover, a conductive adhesive bonding process is avoided, and the cost is reduced.

Description

technical field [0001] The invention relates to a tin filling and grounding process for steel sheets. Background technique [0002] At present, in the field of circuit board design and manufacturing, there are more and more ways to ground steel sheets. Some use pressure-sensitive conductive adhesive + steel sheet grounding methods, and use hot-pressed conductive adhesive + steel sheet grounding methods, which are implemented in production. These traditional processes use pressure-sensitive conductive adhesive + steel grounding method, and the steel grounding often cannot meet the resistance requirements, reaching below 10 ohms, which is easy to cause separation from the FPC. The service life of the solid conductive adhesive is limited, and it is easy to cause the steel sheet and the FPC to be pressed incorrectly, and the manufacturing cost is relatively high. [0003] The patent document whose notification number is CN205912326U conducts further research on this, and disclo...

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Problems solved by technology

[0004] That is to say, the structure of "flexible circuit board (FPC)-conductive adhesive-steel sheet" is recorded in the above-mentioned documents. However, the weak bonding of the conductive adhesive or the poor performance of the conductive adhesive will lead to poor contact with the flexible circuit board, thereby forming a bond with the main board. There is a large impedance in the loop

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