2results about How to "Reduce ground impedance" patented technology

The utility model discloses a cable grounding device, apply to wiring device technical field, including the shielding ring of inside having inner annular groove, the contact finger spring of being sleeved in the inner annular groove, after the shielding layer of cable is turned over and enters the shielding ring, the inside of contact finger spring is contacted with the shielding layer and the shielding layer partial shielding silk is embedded in the contact finger spring, the outside of contact finger spring is extruded contact with the inner annular groove, still include the metal shell of with shielding ring outer wall passes through O type ring connection, the sealing ring, the clamping claw and the galling nut of being connected in proper order in the front end of metal shell, and with the connecting nut assembly of metal shell rear end connection. This cable grounding device can fix the shielding layer of cable, and the production assembly is convenient, and shielding connection is stable and reliable.

The utility model discloses an integrated EMC (Electro Magnetic Compatibility) suppression structure for a power supply module. The integrated EMC suppression structure comprises a composite shielding layer, a multi-stage filtering assembly and a low-impedance grounding structure, a metal shielding cover in the composite shielding layer is matched with a ferrite wave-absorbing layer, so that interference of different frequencies can be inhibited; the multi-stage filtering assembly is provided with different filtering circuits at the input end, the power device pin and the output end respectively, and broadband conducted interference suppression is achieved. The low-impedance grounding structure utilizes four layers of PCBs and conductive silica gel, reduces grounding impedance and gives consideration to heat dissipation, and through collaborative design of the composite shielding layer, the multi-stage filtering assembly and the low-impedance grounding structure, conduction and radiation interference are reduced, and meanwhile, the heat dissipation performance is taken into consideration.