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40results about How to "Reduce ground impedance" patented technology

Heat-conducting bonding pad and package structure of QFP chip with heat-conducting bonding pad

The invention provides a heat-conducting bonding pad and a package structure of a QFP chip with the heat-conducting bonding pad. The heat-conducting bonding pad comprises a bonding pad region and a peripheral region, wherein the bonding pad region is provided with a plurality of bonding pad parts which are arranged in an array; and gaps are formed among the bonding pad parts. The bonding pad parts of the heat-conducting bonding pad are arranged in the array and are isolated from one another, and the area of the bonding pad parts is greatly reduced, so that, on one hand, the escape path of a gas generated by soldering flux pyrolysis in a solder paste in a high-temperature welding process is shortened; and on the other hand, the gaps between the adjacent bonding pad parts provide channels for escape of the gas; the gas can timely escape; the area and the quantity of bubbles are effectively reduced; the condition that the chip has enough heat radiating area is ensured; and the heat radiating effect is improved. Meanwhile, the effective area of a conductor formed by the bonding pad is increased, so that the grounding impedance of the chip is reduced; and the reliability of the chip is improved. The welding effect of the heat-conducting bonding pad is improved; and excessive floating of the chip is avoided, so that the welding reliability of peripheral pins is improved.
Owner:ZHUHAI GREE REFRIGERATION TECH CENT OF ENERGY SAVING & ENVIRONMENTAL PROTECTION

Power transmission line tower grounding design method and device

PendingCN112069608AObtained the counterattack flash rate across the boardReduce ground impedanceGeometric CADData processing applicationsSoil scienceAgricultural engineering
The invention discloses a power transmission line tower grounding design method and device. The method comprises the steps: determining a control target of the counterattack flashover rate of a powertransmission line and grounding impedance limit values of different soil resistivity gears; dividing the power transmission line into a plurality of sections along the power transmission line according to the soil resistivity grades; determining the counterattack flashover rate of each section according to the terrain category and the lightning day parameters in each section along the power transmission line; according to the control target of the counterattack flashover rate of the power transmission line, adjusting the whole line counterattack flashover rate of the power transmission line byadjusting the grounding impedance limit values of different soil resistivity levels; taking the adjusted grounding impedance limit values of different soil resistivity levels as control values of tower grounding impedance of each section of the power transmission line; and according to the control value of the tower grounding impedance, designing the structure and the size of the power transmission line tower grounding device. The problems that in the prior art, the grounding impedance is blindly pursued to be reduced, and economy is poor are solved.
Owner:CHINA ELECTRIC POWER RES INST +2

Novel fixing device and assembling method for high-power radio frequency power amplifiers

The invention discloses a novel fixing device and an assembling method for high-power radio frequency power amplifiers. The fixing device comprises a radiating base, a PCB (printed circuit board) board and a U-shaped piece. The PCB board is arranged tightly on the upper surface layer of the radiating base and provided with a center hole and a pair of fixing holes for connecting, a group of welding pads are arranged along the surrounding edge of the center hole; the central part of the U-shaped piece is an arc-shaped groove body, the upper two sides extend outward to form lugs respectively, each lug is provided with a fixing hole and is connected with the PCB board through an adjusting protection retaining part and a screw which penetrates through the fixing hole;a high-power radio frequency power amplifier is pressed on the radiating base by the central arc-shaped groove body of the U-shaped piece through downward pressure; and the U-shaped piece, the PCB board and the radiating base are connected by the screws or bolts which penetrate through the fixing holes on the lugs. By the assembling method, the high-power radio frequency power amplifiers can be assembled with low cost, good grounding and radiating of the radio frequency amplifiers can be guaranteed, performance consistency of the high-power radio frequency power amplifiers is improved, and production and assembly of the high-power radio frequency power amplifiers are facilitated.
Owner:北京市万格数码通讯科技有限公司

Steel sheet tin filling grounding process

The invention discloses a steel sheet tin filling grounding process, comprising a steel sheet, a flexible circuit board and an electronic component arranged on the circuit board. The electronic component is located on the front of the circuit board, and the steel sheet is located on the back of the circuit board. The circuit board is provided with a through hole in the position corresponding to the electronic component. One end of the through hole is communicated with the electronic component, and the other end of the through hole is communicated with the steel sheet. After tin is poured intothe through hole, the electronic component is connected with the steel sheet. After tin is solidified on the steel sheet, the electronic component and the steel sheet are fixedly combined, a tin layeris formed between the circuit board and the steel sheet, and the steel sheet is tightly combined with the circuit board through the tin layer. Through the process, an FPC-tin layer-steel sheet structure is obtained. The grounding impedance of the FPC and the steel sheet can be greatly reduced, and the static electricity and the overall performance can be significantly improved. Moreover, a conductive adhesive bonding process is avoided, and the cost is reduced.
Owner:蚌埠华特科技有限公司

Underground emergency searching and rescuing wireless communication system for transmitting signals by utilizing rail

The invention belongs to a wireless communication system in an electronic and information field, in particular relating to an underground emergency searching and rescuing wireless communication system for transmitting signals by utilizing a rail. The underground emergency searching and rescuing wireless communication system for transmitting the signals by utilizing the rail does not need to rely on a transmission network possibly destroyed and can also ensure convenient moving and carrying under extreme conditions, such as mine accidents and the like, and can be used as a communication measure for searching and rescuing in an emergency. The wireless communication system is characterized in that an underwater rail is used as a carrier for transmitting electric signals. The wireless communication system adopts low-frequency or very low-frequency wireless electric signals with several kilometers of wave length and strong barrier penetrating ability and uses the rail as a wireless transmitting and receiving antenna so as to ensure that people trapped underwater can keep communication with people on the ground in an emergency. The invention provides a professional emergency searching and rescuing wireless communication system for people trapped underwater.
Owner:张飞然

Installation device and method of radio frequency power amplifier with radiating and grounding performances

The invention provides an installation device and method of a radio frequency power amplifier with radiating and grounding performances. The installation device comprises a radiating base, a PCB (printed circuit board) and a U-shaped fixed seat, wherein the PCB is tightly covered on the upper surface of the radiating base, a center hole is formed on the PCB, the radio frequency power amplifier is placed in the center hole, the shape of the enter hole is matched with the packaging configuration of the radio frequency power amplifier, and a pair of input and output pin welding discs and a pair of grounding welding discs are distributed along the surrounding edge of the center hole; the U-shaped fixed seat comprises a middle U-shaped seat body, end ears are arranged on the two upper sides of the U-shaped seat body, an internal groove of the U-shaped seat body provides a fixing position for the power amplifier, and the end ears on the two sides of the seat body are provided with fixing holes; and the U-shaped fixed seat, the PCB and the radiating base are connected with one another by virtue of screws or bolts. The installation device can be utilized to provide the installation method with low cost of the power amplifier, can ensure the good grounding and radiating performances of the power amplifier, can improve the performance consistence of the power amplifier, and is convenient to be produced and assembled.
Owner:北京市万格数码通讯科技有限公司

Method and device for reducing grounding impedance of transformer substation grounding grid by additionally arranging capacitor module

The invention relates to a method and a device for reducing the grounding impedance of a transformer substation grounding grid by additionally arranging a capacitor module. The device comprises a plurality of capacitor grounding devices, wherein each capacitor grounding device comprises a plurality of capacitor units, an epoxy resin cylinder, a damp-proof sealing ring, a connecting conductor and ametal disc; and the capacitor units are connected in series to operate, the capacitor units are wrapped by the epoxy resin cylinders, the connecting conductors are used for connecting the capacitor units and penetrating through the epoxy resin cylinders, sealing rubber pads are used at the joints of the connecting conductors and the upper ends and the lower ends of the epoxy resin cylinders, andthe metal discs are used at the tail ends of the capacitor grounding devices. According to the method and device, the inductance component proportion of the grounding impedance of the transformer substation grounding grid is measured by using a grounding impedance testing instrument, the specific inductance value of the transformer substation grounding grid is obtained, then the number of the required capacitor grounding devices is obtained, after simulation calculation verification, the corresponding number of capacitor grounding devices are welded to the transformer substation grounding gridto reduce the inductance component of the transformer substation grounding grid, and the effect of reducing the grounding impedance of the transformer substation grounding grid is achieved.
Owner:HONGHE POWER SUPPLY BUREAU OF YUNNAN POWER GRID

A drainage grounding method for suppressing ground potential rise

InactiveCN109038155AReduce the charge density at the tipLow ionization discharge voltageLine/current collector detailsConnection contact member materialHigh pressureSafe operation
The invention discloses a drainage grounding method for inhibiting ground potential rise, which comprises a grounding down lead and a grounding electrode, the grounding electrode is arranged in an original earth diversion area and is connected with the grounding down lead. Also included are a first grounding member and a second grounding member, both of which are disposed in the soil diversion region, and the resistivity of the first grounding member is smaller than the resistivity of the soil diversion region, and the resistivity of the second grounding member is smaller than the resistivityof the first grounding member; and the first grounding member is positioned outside the grounding electrode and in good contact with the grounding electrode, and the second grounding member is positioned below the first grounding member and in good contact with the lower portion of the grounding electrode. The invention can effectively suppress the transient ground counterstrike voltage caused bythe end effect of the grounding device under the lightning impulse, The invention solves the problem that the transient electric potential of the high-voltage transmission and transformation system issharply increased due to the end effect of the grounding device under the lightning impulse in the existing grounding technology, the lightning current cannot be safely and effectively released, theground potential counter-strike voltage is formed, and the safe operation of the power supply system is seriously affected.
Owner:STATE GRID FUJIAN ELECTRIC POWER CO LTD +1

FPC steel sheet reinforcement optimization method, FPC board steel sheet reinforcement structure and electronic equipment

The invention relates to the technical field of circuit boards, in particular to an FPC (Flexible Printed Circuit) steel sheet reinforcement optimization method. An FPC board and a steel sheet are included. The method comprises the following steps of S1, respectively forming via holes in the FPC board or the steel sheet; S2, arranging an activation layer on one surface of the steel sheet; S3, arranging an adhesive layer on the activation layer, and attaching the FPC board to the steel sheet; S4, carrying out surface cleaning on the via hole after lamination; and S5, arranging a soldering tin material on the via hole and carrying out curing treatment to realize soldering tin interconnection of the FPC board and the steel sheet. The invention also provides an FPC board steel sheet reinforcing structure. The invention provides the FPC steel sheet reinforcement optimization method and the FPC board steel sheet reinforcement structure. The FPC steel sheet reinforcing effect is achieved, theactivation layer is arranged on the steel sheet, and the surface is cleaned before tin soldering, so that the steel sheet and the FPC board can be conducted through tin soldering, the grounding impedance performance is improved, and the cost is greatly reduced.
Owner:成都大超科技有限公司

Fixing device and method for power amplifier

The invention discloses a fixing device and method of a power amplifier. The fixing device of the power amplifier includes: a fixing block, including a body and a convex part protruding from the body, and the top of the convex part is welded to the power amplifier; a PCB, including a The convex part is adapted to connect the through hole, the connecting part arranged around the through hole and grounded; the convex part is inserted into the through hole, and the thickness of the PCB is equal to the thickness of the convex part; through the electrical connection between the body and the connecting part, the fixed block is grounded; the heat sink , connected to the bottom surface of the body away from the top of the convex part and the PCB. Through the shape design of the fixing block and its connection with the PCB and the radiator, the present invention makes the cost of the fixing device of the power amplifier lower, the grounding impedance is low and the heat dissipation performance is good; and the manufacturing process of the present invention is simpler and the degree of automation is higher High, while ensuring the reliability of the power amplifier, it reduces the overall production cost and improves the cost performance of the product.
Owner:SHENZHEN EXCERA TECH
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