Packaging structure and packaging method of bracket type electronic label

Abstract

The invention belongs to the technical field of electronic label packaging, and specifically discloses a packaging structure and a packaging method of a bracket type electronic label. The packaging structure comprises an integrated circuit, an antenna core material and a packaging material; the integrated circuit comprises a bracket, a wafer and a packaging adhesive material; the wafer is glued inthe bracket and electrically connected with the bracket through a bonding wire; and the integrated circuit and the antenna core material are subjected to primary packaging to form a label core material finished product, and finally, the label core material finished product and the packaging material are subjected to secondary packaging to prepare the electronic label. By virtue of the packaging structure, the reliability of the electronic label is obviously improved and the cost is obviously lowered, thereby enabling wide application of the electronic label to be possible; and in addition, the packaging method has a simple technological process, less equipment investment and capability of effectively lowering the manufacturing cost of the integrated circuit.

Description

technical field [0001] The invention belongs to the technical field of electronic label packaging, and in particular relates to a package structure and a package method of a bracket type electronic label. Background technique [0002] Radio frequency identification technology (RFID, Radio Frequency Identification) is a communication technology, which automatically identifies the target object and obtains relevant data information through radio frequency signals, and uses radio frequency to conduct non-contact two-way communication to achieve the purpose of identification and exchange data. The identification work does not require Manual intervention, has the advantages of fast recognition speed, dynamic real-time communication, penetrability and barrier-free reading, better security, large storage data capacity, long service life, etc., widely used in logistics, retail, manufacturing, anti-counterfeiting, asset management , identification, transportation and other applicatio...

AI Technical Summary

Problems solved by technology

[0005] The integrated circuit (IC) used in conventional RFID tags is a flip chip, and the bump manufacturing process in the flip chip is complicated, the production equipment is expensive, and there are low production efficiency when connecting the flip chip and the circuit board. Poor reliability and other issues

Therefore, although the industry is generally optimistic about the prospects of RFID technology, problems such as high production costs, low production efficiency, and poor reliability of electronic tags have seriously restricted the commercialization of RFID technology in practical applications.

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