Structure of finishing equipment for chemical mechanical planarization pad and manufacturing method thereof

Abstract

The invention relates to a structure of finishing equipment for a chemo-mechanical planarization pad and a manufacturing method thereof. The finishing equipment comprises a finishing disc base with thread through holes, base columns with abrasive particles with different diameters or densities, a horizontal measuring disc, a connecting rod and a cantilever. The surface of a finishing disc is constituted by four grinding units. Each grinding unit is constituted by the multiple base columns, and each base column is provided with the corresponding abrasive particles. The base columns with the abrasive particles can be screwed into the through holes of the base, and the high-low degree of the parts, exposed out of the highest points of the abrasive particles, of the base columns can be adjusted. The abrasive particles are fixed to the surfaces of the base columns in an electric chemical method. After the heights of the abrasive particles of the whole finishing disc are measured by the horizontal measuring disc, the finishing disc can be applied to finishing operation of the planarization pad. Through combination of the different base columns, the densities of the abrasive particles anddistribution of the diameters of the abrasive particles in the finishing disc can be adjusted, the polishing speed and abrasion degree of the finishing disc to the planarization pad are controlled, and the planarization pad can be finished effectively.

Description

technical field [0001] The invention relates to the field of chemical mechanical polishing, in particular to a manufacturing method of a dresser for a polishing pad. Background technique [0002] Chemical mechanical polishing (Chemical Mechanical Planarization, CMP) is currently the most important technology in the surface planarization process of semiconductor wafers. In the CMP process, the polishing pad and the polishing fluid combine to remove excess material in a way that completely planarizes or maintains flatness to accept the next layer of material. These layers are stacked and combined in a certain way to form an integrated circuit. With the development trend of miniaturization of semiconductor devices, more and more metallization levels are required, and these smaller and smaller line pitches have higher requirements on CMP consumables (polishing fluid and polishing pad). The polishing pad transports the polishing liquid stably and evenly between the wafer and th...

AI Technical Summary

Problems solved by technology

At present, the surface of most polishing pad dressers is to directly couple the metal coupling material for abrasive particles to the dressing disc through high-temperature brazing or sintering. Since brazing or sintering needs to go through high-temperature processing, the disc body will be deformed by thermal stress, thus The highest point of the abrasive particles on the working surface is often not on the same horizontal line, which affects the flatness of the working surface of the dresser and can affect the dressing effect of the polishing pad

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